category: Top Stories

category: Auto, Security & Edge AI

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

What’s Next For NAND?
By Mark LaPedus - 19 May, 2016 - Comments: 2

NAND flash memory is a key enabler in today’s systems, but it’s a difficult business. NAND suppliers require deep pockets and strong technology to survive in the competitive landscape. And going forward, vendors face new challenges on several fronts. On one front, for example, the overall NAND market is currently in the doldrums, amid soft product prices and a mild capacity glut. Demand ... » read more

One-On-One: Dave Hemker
By Ed Sperling - 19 May, 2016 - Comments: 0

Dave Hemker, CTO at [getentity id="22820" comment="Lam Research"], sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, and some of the key developments that will reshape the semiconductor industry in the future. What follows are excerpts of that conversation. SE: One of the big discussion topics these days is [getkc id="208" commen... » read more

Bulk CMOS Vs. FD-SOI
By Mark LaPedus - 19 May, 2016 - Comments: 2

The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

Building A Better Resonator
By Katherine Derbyshire - 19 May, 2016 - Comments: 0

The resonant frequency of a beam depends on the mass and stiffness of the beam. Resonance has always been important in the design of musical instruments and amplification systems, as well as the design of bridges and buildings. With the advent of MEMS fabrication techniques, though, came the ability to create very small beams, in the micron or nanometer size range, with resonant frequencies ... » read more

What Happened To DSA?
By Mark LaPedus - 19 May, 2016 - Comments: 2

Directed self-assembly (DSA) was until recently a rising star in the next-generation lithography (NGL) landscape, but the technology has recently lost some of its luster, if not its momentum. So what happened? Nearly five years ago, an obscure patterning technology called [gettech id="31046" t_name="DSA"] burst onto the scene and began to generate momentum in the industry. At about that t... » read more

Bridging the IP Divide
By Brian Bailey - 18 May, 2016 - Comments: 1

IP reuse enabled greater efficiency in the creation of large, complex SoCs, but even after 20 years there are few tools to bridge the divide between the IP provider and the IP user. The problem is that there is an implicit fuzzy contract describing how the IP should be used, what capabilities it provides, and the extent of the verification that has been performed. IP vendors have been trying to... » read more

The Evolving Thermal Landscape
By Ann Mutschler - 16 May, 2016 - Comments: 0

Managing heat in chips is becoming a precision balancing act at advanced nodes and with advanced packaging. While it's important to ensure that temperatures don't rise high enough to cause reliability problems, adding too much circuitry to control heat can reduce performance and lower energy efficiency. The most common approach to dealing with these issues is thermal simulation, which requir... » read more

Power-Centric Chip Architectures
By Ed Sperling - 12 May, 2016 - Comments: 0

As traditional scaling runs out of steam, new chip architectures are emerging with power as the starting point. While this trend has been unfolding for some time, it is getting an extra boost and sense of urgency as design teams weigh a growing number of design challenges and options across a variety of new markets. Among the options are [getkc id="196" kc_name="multi-patterning"] and [getkc... » read more

IP Business Models In Flux
By Ann Mutschler - 12 May, 2016 - Comments: 0

EDA and IP suppliers are engaging with foundries earlier with each manufacturing process node, while those foundries are providing ever more optimized and tuned processes to their customers. As part of this, IP providers must port their IP offerings to the various foundries and processes, putting a squeeze on resources. That raises some difficult questions, such as how to prioritize their li... » read more

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