Keeping The Whole Package Cool


Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but the ability to dissipate the heat depends on the package surface area. Because the goal of 3D packaging is to squeeze more transistors into less overall space, new heat dissipation issues are em... » read more

FinFET Scaling Reaches Thermal Limit


In 1974, Robert H. Dennard was working as an IBM researcher. He introduced the idea that MOSFETs would continue to work as voltage-controlled switches in conjunction with shrinking features, providing doping levels, the chip's geometry, and voltages are scaled along with those size reductions. This became known as Dennard's Law even though, just like Moore's Law, it was anything but a law. T... » read more

2.5D Becomes A Reality


Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

Grappling With IoT Security


By Ed Sperling & Ernest Worthman As the IoT begins to take shape, the security implications of connecting devices and systems to the Internet and what needs to be done to secure them are coming into focus, as well. There is growing consensus across the semiconductor industry that many potential security holes remain, with new ones surfacing all the time. But there also is widespread r... » read more

Autonomous Vehicle Disruptions Ahead


The promise of autonomous driving is a significant one, with far fewer fatalities from vehicle crashes — down from 30,000 annually — topping the list of benefits. Beyond that, autonomous driving also promises increased convenience and productivity and less troublesome commutes. But autonomous driving also pushes automotive technology into uncharted areas. There is little to fall back on ... » read more

Virtualization Revisited


Virtual instruction set computing (VISC) is getting a second look as power and performance improvements begin to slow and [getkc id="74" comment="Moore's Law"] is supplanted by [getkc id="279" comment="Koomey's Law"]. While the current crop of [getkc id="185" kc_name="finFETs"] will likely be extended for at least one more process node, there is some debate about what comes next, whether tha... » read more

Rethinking Processor Architectures


The semiconductor industry's obsession with clock speeds, cores and how many transistors fit on a piece of silicon may be nearing an end for real this time. The [getentity id="22048" comment="IEEE"] said it will develop the International Roadmap for Devices and Systems (IRDS), effectively setting the industry agenda for future silicon benchmarking and adding metrics that are relevant to specifi... » read more

Next-Gen Botnets


Botnets, once limited to computer networks, are expanding and changing as more devices are connected to the Internet—and becoming much harder to detect and destroy. The term botnet—a contraction for robotic networks—conjures up the days when it was just a collection of computers that were largely autonomous, on a local network and usually assigned to repetitive tasks. But that is chang... » read more

End Of Mixed Signal Engineering?


EDA companies are stepping back after years of trying to force engineers to combine analog and digital disciplines. Rather than emphasizing [getkc id="38" kc_name="mixed signal"] as a single expertise, they are building bridges and translation mechanisms between the two worlds. The moves cap more than a decade of trying to find optimal ways to pack [getkc id="37" kc_name="analog"] and digita... » read more

Automating System Design


Change is underway in the chip design world, creating opportunities and challenges that reach far beyond questions about whether Moore’s Law is slowing or stopping. Never before in the history of semiconductors has design been so complex and sophisticated, and never has it touched so many lives in so many interesting ways. This is all happening as a result of the chip’s enabling role in ... » read more

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