category: Top Stories

category: IoT, Security & Automotive

Productivity And The IoT
By Ann Mutschler - 25 Sep, 2014 - Comments: 0

The market for devices that connect almost everything to the [getkc id="76" comment="Internet of Things"] is projected to explode, creating opportunities for companies that haven’t been traditional chip developers to decide to start developing devices. Semiconductor Engineering sat down to discuss this topic with Jack Guedj, corporate VP of Tensilica products at [getentity id="22032" e_name="... » read more

Time To Market Concerns Worsen
By Ed Sperling - 25 Sep, 2014 - Comments: 1

Time to market has always been an issue for chipmakers in highly competitive sectors, but as complexity of chips continues to grow at advanced nodes, and as markets shift increasingly toward consumer electronics, it has jumped to the No. 1 concern. Interviews with engineers at multiple levels inside of some of the largest and midsize chipmakers, conducted by Semiconductor Engineering over th... » read more

Executive Insight: Lip-Bu Tan
By Ed Sperling - 22 Sep, 2014 - Comments: 0

Semiconductor Engineering sat down with [getperson id="11693" comment="Lip-Bu Tan"], president and CEO of [getentity id="22032" e_name ="Cadence"], to discuss his outlook on EDA, Moore’s Law and his strategy for investing in startups around the world. What follows are excerpts of that conversation. SE: What’s worrying you these days? Tan: There are a couple of things. One is the complex... » read more

What Will That DSA Template Do, Anyway?
By Katherine Derbyshire - 22 Sep, 2014 - Comments: 0

As directed self assembly techniques make the transition from line and space test patterns to the more complex structures seen in real devices, modeling is emerging as a significant issue. How will the co-polymers behave in the presence of a particular template pattern? While several laboratory-scale modeling methods exist, most are too computationally expensive to be used for large area str... » read more

One-On-One: Mark Bohr
By Mark LaPedus - 18 Sep, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss process technology, transistor trends, chip-packaging and other topics with Mark Bohr, a senior fellow and director of process architecture and integration at Intel. SE: Intel recently introduced chips based on its new 14nm process. Can you briefly describe the 14nm process? Bohr: It’s our second-generation, tri-gate technology. So it has al... » read more

EDA Vendors Prepare For 7nm
By Ann Mutschler - 18 Sep, 2014 - Comments: 0

It’s not too early to begin looking at design tools for the 7nm, even though the node is not expected to be production-ready until later this decade. While still in the early stages, foundries already in development with leading EDA companies, even though the water remains murky at this point. “7nm right now is in early definition, so we don't know exactly what it will be,” observed... » read more

Wanted: Multi-beam E-Beam Inspection
By Mark LaPedus - 18 Sep, 2014 - Comments: 0

The IC industry is making a giant leap from planar devices to a range of next-generation architectures, such as 3D NAND and finFETs. But it’s taking longer than expected to ramp up these new technologies in the market. And the challenges are expected to mount for the next round of chips. It’s difficult to pinpoint the exact issues with 3D NAND and finFETs. On the manufacturing front alo... » read more

Predictive Fab Management
By Michael Watts - 18 Sep, 2014 - Comments: 0

Managing variation requires a different approach in fab management, moving from reactive to predictive methodologies. This is easier said than done, however. Predictive fab management requires a much more detailed understanding of everything happening in the fab, including process variation, equipment variation, mix variation—all of which must be managed with dispatch strategies to produc... » read more

Navigating The Used Equipment Market
By Mark LaPedus - 18 Sep, 2014 - Comments: 0

For years, the used semiconductor equipment market has been an important but obscure part of the IC manufacturing supply chain. In fact, nearly all chipmakers have bought used tools over the years. Buying used equipment is a quick and relatively inexpensive way to fill a particular need in both 200mm and 300mm fabs. But after years of flying under the radar, the used IC equipment market is h... » read more

Changing The IP Supplier Paradigm
By Brian Bailey - 17 Sep, 2014 - Comments: 0

Semiconductor Engineering sat down with Rich Wawrzyniak, senior market analyst for ASIC and SoC at Semico Research; John Koeter, vice president of marketing for the Solutions Group at [getentity id="22035" e_name="Synopsys"]; Mike Gianfagna, vice president of marketing for [getentity id="22242" e_name="eSilicon"]; Peter McGuinness, director of technology marketing at [getentity id="22709" e_nam... » read more

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