category: Top Stories

category: IoT, Security & Automotive

Using Real Workloads To Assess Thermal Impacts
By Ann Mutschler - 14 Dec, 2023 - Comments: 0

Thermal analysis is being driven much further left in the design, fueled by demand for increased transistor density and more features on a chip or in a package, as well as the unique ways the various components may be exercised or stressed. However, getting a clear picture of the thermal activity in advanced-node chips and packages is extremely complex, and it can vary significantly by use c... » read more

Data Formats For Inference On The Edge
By Brian Bailey - 14 Dec, 2023 - Comments: 0

AI/ML training traditionally has been performed using floating point data formats, primarily because that is what was available. But this usually isn't a viable option for inference on the edge, where more compact data formats are needed to reduce area and power. Compact data formats use less space, which is important in edge devices, but the bigger concern is the power needed to move around... » read more

Next-Gen Power Integrity Challenges
By Ed Sperling - 14 Dec, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss power integrity challenges and best practices in designs at 7nm and below, and in 2.5D and 3D-IC packages, with Chip Stratakos, partner, physical design at Microsoft; Mohit Jain, principal engineer at Qualcomm; Thomas Quan, director at TSMC; and Murat Becer, vice president at Ansys. What follows are excerpts of that conversatio... » read more

The Uncertain Future Of In-Memory Compute
By Karen Heyman - 13 Dec, 2023 - Comments: 0

Experts at the Table — Part 2: Semiconductor Engineering sat down to talk about AI and the latest issues in SRAM with Tony Chan Carusone, chief technology officer at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be found here and part 3 is h... » read more

Testing ICs Faster, Sooner, And Better
By Laura Peters - 12 Dec, 2023 - Comments: 0

The infrastructure around semiconductor testing is changing as companies build systems capable of managing big data, utilizing real-time data streams and analysis to reduce escape rates on complex IC devices. At the heart of these tooling and operational changes is the need to solve infant mortality issues faster, and to catch latent failures before they become reliability problems in the fi... » read more

Closing The Test And Metrology Gap In 3D-IC Packages
By Gregory Haley - 12 Dec, 2023 - Comments: 0

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and wearable tech most likely will be powered by multiple layers of intricately connected silicon, a stark departure from the planar landscapes of traditional integrated circuits. These 3D-ICs, compos... » read more

Fingerprinting Chips For Traceability
By Anne Meixner - 12 Dec, 2023 - Comments: 0

Semiconductor components increasingly require unclonable and tamper resistant identifiers, which are especially necessary as devices become increasingly heterogeneous collections of chiplets and subsystems. These fingerprints provide traceability, which contributes to process improvements and yield learning and enable tracking for a tightly managed supply chain. While some of this technology... » read more

Security Becoming Core Part Of Chip Design — Finally
By Ann Mutschler - 07 Dec, 2023 - Comments: 1

Security is shifting both left and right in the design flow as chipmakers wrestle with how to build devices that are both secure by design and resilient enough to remain secure throughout their lifetimes. As increasingly complex devices are connected to the internet and to each other, IP vendors, chipmakers, and systems companies are racing to address existing and potential threats across a ... » read more

Auto Network Speeds Rise As Carmakers Prep For Autonomy
By John Koon - 07 Dec, 2023 - Comments: 0

In-vehicle networks are starting to migrate from domain architectures to zonal architectures, an approach that will simplify and speed up communication in a vehicle using fewer protocols, less wiring, and ultimately lower cost. Zonal architectures will partition vehicles into zones that are more manageable and flexible, but getting there will take time. There is so much legacy technology in ... » read more

AI Races To The Edge
By Karen Heyman - 07 Dec, 2023 - Comments: 0

AI is becoming increasingly sophisticated and pervasive at the edge, pushing into new application areas and even taking on some of the algorithm training that has been done almost exclusively in large data centers using massive sets of data. There are several key changes behind this shift. The first involves new chip architectures that are focused on processing, moving, and storing data more... » read more

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