category: Top Stories

category: IoT, Security & Automotive

Rethinking Engineering Education In The U.S.
By Karen Heyman - 11 May, 2023 - Comments: 8

The CHIPS Act, as well as the ongoing need for talent, is causing both industry and academia in America to rethink engineering education, resulting in new approaches and stronger partnerships. As an example, Arizona State University (ASU) now has a Secure, Trusted, and Assured Microelectronics Center (STAM). The center offers an interdisciplinary approach to learning secure and trusted semic... » read more

Designing Crash-Proof Autonomous Vehicles
By John Koon - 10 May, 2023 - Comments: 0

Autonomous vehicles keep crashing into things, even though ADAS technology promises to make driving safer because machines can think and react faster than human drivers. Humans rely on seeing and hearing to assess driving conditions. When drivers detect objects in front of the vehicle, the automatic reaction is to slam on the brakes or swerve to avoid them. Quite often drivers cannot react q... » read more

Pinpointing Timing Delays Can Improve Chip Reliability
By Anne Meixner - 09 May, 2023 - Comments: 0

Growing pressure to improve IC reliability in safety- and mission-critical applications is fueling demand for custom automated test pattern generation (ATPG) to detect small timing delays, and for chip telemetry circuits that can assess timing margin over a chip's lifetime. Knowing the timing margin in signal paths has become an essential component in that reliability. Timing relationships a... » read more

3D Structures Challenge Wire Bond Inspection
By Karen Heyman - 09 May, 2023 - Comments: 1

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem like old technology, but it remains the bonding approach of choice for a broad swath of applications. This is particularly evident in automotive, industrial, and many consumer applications, where the majority of chips are not de... » read more

Optimizing Scan Test For Complex ICs
By Gregory Haley - 09 May, 2023 - Comments: 0

As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin availability. In addition, the complexity of emerging packages like 3D and chiplets necessitates comprehensive new solutions that can provide faster results at multiple stages in the silicon lifec... » read more

ML Automotive Chip Design Takes Off
By Ann Mutschler - 04 May, 2023 - Comments: 0

Machine learning is increasingly being deployed across a wide swath of chips and electronics in automobiles, both for improving reliability of standard parts and for the creation of extremely complex AI chips used in increasingly autonomous applications. On the design side, the majority of EDA tools today rely on reinforcement learning, a machine learning subset of AI that teaches a machine ... » read more

Data Leakage Becoming Bigger Issue For Chipmakers
By Ed Sperling - 04 May, 2023 - Comments: 0

Data leakage is becoming more difficult to stop or even trace as chips become increasingly complex and heterogeneous, and as more data is stored and utilized by chipmakers for other designs. Unlike a cyberattack, which typically is done for a specific purpose, such as collecting private data or holding a system ransom, data leaks can spring up anywhere. And as the value of data increases, th... » read more

Role Of IoT Software Expanding
By John Koon - 04 May, 2023 - Comments: 0

IoT software is becoming much more sophisticated and complex as vendors seek to optimize it for specific applications, and far more essential for vendors looking to deliver devices on-time and on-budget across multiple market segments. That complexity varies widely across the IoT. For example, the sensor monitoring for a simple sprinkler system is far different than the preventive maintenanc... » read more

Startup Funding: April 2023
By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

AI Adoption Slow For Design Tools
By Brian Bailey - 01 May, 2023 - Comments: 0

A lot of excitement, and a fair amount of hype, surrounds what artificial intelligence (AI) can do for the EDA industry. But many challenges must be overcome before AI can start designing, verifying, and implementing chips for us. Should AI replace the algorithms in use today, or does it have a different role to play? At the end of the day, AI is a technique that has strengths and weaknesses... » read more

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