Startup Funding: March 2023

By Jesse Allen - 05 Apr, 2023 - Comments: 0

Funding was broadly spread between sectors in March, with automotive edging ahead thanks to a more than $100 million round for a company manufacturing electric, autonomous heavy commercial trucks for freight logistics. To keep up with the amount of information presented by cars and ADAS, several companies raised funds for head-up displays with increasing levels of detail and expanded fields of ... » read more

Mechanical Challenges Rise With Heterogeneous Integration

By Ed Sperling - 03 Apr, 2023 - Comments: 0

Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect technologies, and a shortage of expertise are making it difficult to address those issues. Throughout most of the history of the semiconductors, few people outside of foundries worried about struc... » read more

Power Semiconductors: A Deep Dive Into Materials, Manufacturing & Business

By The SE Staff - 03 Apr, 2023 - Comments: 0

Whether you’re the owner of the average smartphone, commuting on trains, or driving around in a Tesla, you use power semiconductor devices every day. In a technology-dependent world, these devices are everywhere, and demand for more types of chips using different materials is growing. In the past, most engineers paid little attention to power semiconductors. They were deemed commodity, off... » read more

Do Necessary Tools Exist For RISC-V Verification?

By Brian Bailey - 30 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss the verification of RISC-V processors with Pete Hardee, group director for product management at Cadence; Mike Eftimakis, vice president for strategy and ecosystem at Codasip; Simon Davidmann, founder and CEO of Imperas Software; Sven Beyer, program manager for processor verification at Siemens EDA; Kiran Vittal, senior director of alliances partner... » read more

Options Widen For Optimizing IoT Designs

By John Koon - 29 Mar, 2023 - Comments: 0

Creating a successful IoT design requires a deep understanding of the use cases, and a long list of tradeoffs among various components and technologies to provide the best solution at the right price point. Maximizing features and functions while minimizing costs is an ongoing balancing act, and the number of choices can be overwhelming. The menu includes SoC selection, OS and software proto... » read more

AI Becoming More Prominent In Chip Design

By Ed Sperling - 27 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about the role of AI in managing data and improving designs, and its growing role in pathfinding and preventing silent data corruption, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta... » read more

True 3D Is Much Tougher Than 2.5D

By Brian Bailey - 23 Mar, 2023 - Comments: 0

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D designs, there are multiple interpretations about what 3D entails. This is more than just semantics, however, because each packaging option requires different design approaches and technologies. And a... » read more

The Race Toward Mixed-Foundry Chiplets

By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

Managing EDA’s Rapid Growth Expectations

By Brian Bailey - 23 Mar, 2023 - Comments: 0

The EDA industry has been doing very well recently, but how long this run will continue is a matter of debate. EDA is an industry ripe for disruption due to rapid changes in chip architectures, end markets, and a long list of new technologies. In addition, recent geopolitical tensions are bringing a lot more attention to this small sector upon which the whole semiconductor industry rests. De... » read more

Big Changes Ahead In Power Delivery, Materials, And Interconnects

By Laura Peters - 22 Mar, 2023 - Comments: 0

Part one of this forecast looked at evolving transistor architectures and lithography platforms. This report examines revolutions in interconnects and packaging. When it comes to device interconnects, it’s hard to beat copper. Its low resistivity and high reliability have served the industry exceedingly well as both on-chip interconnect and wires between chips. But in logic chips, with int... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.