category: Top Stories

category: IoT, Security & Automotive

Not All There: Heterogeneous Multiprocessor Design Tools
By Brian Bailey - 26 Jun, 2023 - Comments: 0

The design, implementation, and programming of multicore heterogeneous systems is becoming more common, often driven by the software workloads, but the tooling to help optimize the processors, interconnect, and memory are disjointed. Over the past few years, many tools have emerged that help with the definition and implementation of a single processor, optimized for a given set of software. ... » read more

The Uncertainties Of RISC-V Compliance
By Ann Mutschler - 22 Jun, 2023 - Comments: 0

How far can a RISC-V design be pushed and still be compliant? The answer isn't always black-and-white because the RISC-V concept is very different from previous open-source projects. But as interest and activity in RISC-V continues to grow, constructive discussions are taking place to address some of the challenges of designing with an open-standard ISA. “The RISC-V standard is somethin... » read more

Verification And Test Of Safety And Security
By Brian Bailey - 22 Jun, 2023 - Comments: 0

Functional verification can cost as much as design, but new capabilities are piling onto an already stressed verification methodology, leaving solutions fragmented and incomplete. In a perfect world, a semiconductor device would be verified to operate according to its complete specification, and continue to operate correctly over the course of its useful life. The reality, however, is this i... » read more

Better Choreography Required For Complex Chips
By Karen Heyman - 22 Jun, 2023 - Comments: 0

The rapidly growing number of features and options in chip design are forcing engineering teams to ratchet up their planning around who does what, when it gets done, and how various components will interact. In effect, more elements in the design flow need to be choreographed much more precisely. Some steps have to shift further left, while others need to be considered earlier in the plannin... » read more

Preparing For 5G Millimeter Wave And 6G
By Ed Sperling - 21 Jun, 2023 - Comments: 0

Cellular technology is about to take a giant leap forward, but the packaging, assembly, and testing of the chips used in 5G millimeter wave and the forthcoming 6G ecosystem will be significantly more complicated than anything used in the past. So far, most 5G devices are still working at sub-6 GHz frequencies. A massive rollout of mmWave technology over the next few years will significantly ... » read more

Why Auto Ecosystem Relationships Are Changing
By Ann Mutschler - 19 Jun, 2023 - Comments: 0

The automotive industry is in the midst of rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, electrification, autonomous features, as well as new vehicle architectures that will determine how vehicles are going to be designed from the foundation up. But all of this is dependent on the relationships between all of the ecosyst... » read more

193i Lithography Takes Center Stage…Again
By Gregory Haley - 15 Jun, 2023 - Comments: 0

Cutting-edge lithography to create smaller features increasingly is being supplemented by improvements in lithography for mature process nodes, both of which are required as SoCs and complex chips are decomposed and integrated into advanced packages. Until the 7nm era, the primary goal of leading-edge chipmakers was to pack everything onto a single system-on-chip (SoC) using the same process... » read more

Smart Manufacturing Makes Gains In Chip Industry
By Anne Meixner - 15 Jun, 2023 - Comments: 0

Lights out manufacturing is gaining steam across the semiconductor industry, accelerating productivity, improving quality, and reducing costs and environment impact. These benefits are the result of years of strategic investments in technologies like machine-to-machine communication, data analytics, and robotics to achieve higher levels of autonomy. Semiconductor factories have long depen... » read more

Will CFETs Help The Industry Go Vertical?
By Katherine Derbyshire - 15 Jun, 2023 - Comments: 0

Device scaling is getting much harder at each new process node. Even defining what it means is becoming a challenge. In the past, gate length and metal pitch went down and device density went up. Today, this is much harder for several reasons: • Short channel effects limit gate-length scaling; • Parasitic effects limit device density, and • Metal resistance limits metal pitch. So r... » read more

CEO Outlook: Chiplets, Data Management, And Reliability
By Ed Sperling - 14 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about changes in chip design with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; ... » read more

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