Next Steps For Improving Yield


Chipmakers are ramping new tools and methodologies to achieve sufficient yield faster, despite smaller device dimensions, a growing number of systematic defects, immense data volumes, and massive competitive pressure. Whether a 3nm process is ramping, or a 28nm process is being tuned, the focus is on reducing defectivity. The challenge is to rapidly identify indicators that can improve yield... » read more

Legacy Tools, New Tricks: Optical 3D Inspection


Stacking chips is making it far more difficult to find existing and latent defects, and to check for things like die shift, leftover particles from other processes, co-planarity of bumps, and adhesion of different materials such as dielectrics. There are several main problems: Not everything is visible from a single angle, particularly when vertical structures are used; Various struc... » read more

Test Connections Clean Up With Real-Time Maintenance


Test facilities are beginning to implement real-time maintenance, rather than scheduled maintenance, to reduce manufacturing costs and boost product yield. Adaptive cleaning of probe needles and test sockets can extend equipment lifetimes and reduce yield excursions. The same is true for load board repair, which is moving toward predictive maintenance. But this change is much more complicate... » read more

Memory-Based Cyberattacks Become More Complex, Difficult To Detect


Memories are becoming entry points for cyber attacks, raising concerns about system-level security because memories are nearly ubiquitous in electronics and breaches are difficult to detect. There is no end in sight with hackers taking aim at almost every consumer, industrial, and commercial segment, and a growing number of those devices connected to the internet and to each other. According... » read more

AI Feeds Vision Processor, Image Sensor Boom


Vision systems are rapidly becoming ubiquitous, driven by big improvements in image sensors as well as new types of sensors. While the sensor itself often is developed using mature-node silicon, increasingly it is connected to vision processors developed at the most advanced process nodes. That allows for the highest performance per watt, and it also allows designs to incorporate AI accelera... » read more

Post-Quantum And Pre-Quantum Security Issues Grow


General-purpose quantum computers will be able to crack the codes that protect much of the world’s information, and while these machines don’t exist yet, security experts say governments and businesses are starting to prepare for encryption in a post-quantum world. The task is made all the more challenging because no one knows exactly how future quantum machines will work, or even which mat... » read more

Startup Funding: October 2022


Investors poured $3.5 billion into 113 startup companies in October 2022, especially new battery technology, AI hardware, and faster memory access. Battery technology dominated the fundraising in October thanks to the U.S. Department of Energy and four funding rounds that exceeded $200M. The DOE awarded sizeable grants to help 20 companies, including six startups, build out battery material ... » read more

Chip Design Shifts As Fundamental Laws Run Out Of Steam


Dennard scaling is gone, Amdahl's Law is reaching its limit, and Moore's Law is becoming difficult and expensive to follow, particularly as power and performance benefits diminish. And while none of that has reduced opportunities for much faster, lower-power chips, it has significantly shifted the dynamics for their design and manufacturing. Rather than just different process nodes and half ... » read more

Chip Industry Earnings: A Mixed Bag


Editor's Note: Updated the week of Oct. 31 and Nov. 7 for additional earnings releases. Although most companies reported revenue growth, this latest round of chip industry earnings releases reflected a few major themes: Lower future quarter guidance to varying degrees, due to the recent U.S. export restrictions related to China; Negative impact of the inflationary environment on corn... » read more

Raising IP Integration Up A Level


An increase in the number and complexity of IP blocks, coupled with changing architectures and design concerns, are driving up the need for new tools that can enable, automate, and optimize integration in advanced chips and packages. Power, security, verification and a host of other issues are cross-cutting concerns, and they make pure hierarchical approaches difficult. Adding to future comp... » read more

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