Toward Domain-Specific EDA

By Brian Bailey - 26 Sep, 2022 - Comments: 0

More companies appear to be creating custom EDA tools, but it is not clear if this trend is accelerating and what it means for the mainstream EDA industry. Whenever there is change, there is opportunity. Change can come from new abstractions, new options for optimization, or new limitations that are imposed on a tool or flow. For example, the slowing of Moore's Law means that sufficient prog... » read more

Strengthening The Global Semi Supply Chain

By Ann Mutschler - 22 Sep, 2022 - Comments: 0

Within the semiconductor ecosystem, there are a number of dynamics pointing to the need for new ways of partnering in more meaningful ways that bring resiliency to the global semiconductor supply chain. One of these is the move to bespoke silicon, stemming from a shift in the companies that create most SoCs today -- the hyperscalar cloud providers. These market leaders know their workloads so w... » read more

Can ML Help Verification? Maybe

By Brian Bailey - 22 Sep, 2022 - Comments: 0

Functional verification produces an enormous amount of data that could be used to train a machine learning system, but it's not always clear which data is useful or whether it can help. The challenge with ML is understanding when and where to use it, and how to integrate it with other tools and approaches. With a big enough hammer, it is tempting to call everything a nail, and just throwing ... » read more

Progress In Quantum Computing

By Marie C. Baca - 22 Sep, 2022 - Comments: 0

A recent wave of quantum computing investment has given rise to claims of a quantum computing bubble, based on overly optimistic technological claims in a field area that experts say has yet to demonstrate any real utility. But executives on the industry’s front lines say quantum computing is indeed a commercially viable technology, albeit one that is at least several years away from overcomi... » read more

How Memory Design Optimizes System Performance

By John Koon - 21 Sep, 2022 - Comments: 0

Exponential increases in data and demand for improved performance to process that data has spawned a variety of new approaches to processor design and packaging, but it also is driving big changes on the memory side. While the underlying technology still looks very familiar, the real shift is in the way those memories are connected to processing elements and various components within a syste... » read more

10 Questions: Handel Jones

By Ed Sperling - 20 Sep, 2022 - Comments: 0

Handel Jones, CEO of International Business Strategies and author of a new book, "When AI Rules The World," sat down with Semiconductor Engineering to talk about the growth and impact of AI. What follows are excerpts of that conversation. SE: What do you see as the impact of AI on semiconductors? Jones: The fact that you have a 5G smart phone is because of AI. Steve Jobs changed the smart... » read more

Why Geofencing Will Enable L5

By Marie C. Baca - 19 Sep, 2022 - Comments: 1

What will it take for a car to be able to drive itself anywhere a human can? Ask autonomous vehicle experts this question and the answer invariably includes a discussion of geofencing. In the broadest sense, geofencing is simply a virtual boundary around a physical area. In the world of self-driving cars, it describes a crucial subset of the operational design domain — the geographic regio... » read more

Improving Redistribution Layers for Fan-out Packages And SiPs

By Laura Peters - 15 Sep, 2022 - Comments: 2

Redistribution layers (RDLs) are used throughout advanced packaging schemes today including fan-out packages, fan-out chip on substrate approaches, fan-out package-on-package, silicon photonics, and 2.5D/3D integrated approaches. The industry is embracing a variety of fan-out packages especially because they deliver design flexibility, very small footprint, and cost-effective electrical connect... » read more

How To Compare Chips

By Ed Sperling - 15 Sep, 2022 - Comments: 0

Traditional metrics for semiconductors are becoming much less meaningful in the most advanced designs. The number of transistors packed into a square centimeter only matters if they can be utilized, and performance per watt is irrelevant if sufficient power cannot be delivered to all of the transistors. The consensus across the chip industry is that the cost per transistor is rising at each ... » read more

The High Price Of Smaller Features

By Katherine Derbyshire - 15 Sep, 2022 - Comments: 0

The semiconductor industry’s push for higher numerical apertures is driven by the relationship between NA and critical dimension. As the NA goes up, the CD goes down: Where λ is the wavelength and k1 is a process coefficient. While 0.55 NA exposure systems will improve resolution, Larry Melvin, principal engineer at Synopsys, noted that smaller features always come with a process cos... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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