IP MarketPlace – Act I

By Mike Gianfagna - 29 Jan, 2015 - Comments: 0

We did our first webinar for IP MarketPlace last week. Because there is such a vibrant roadmap for this rich IP exploration environment, I felt like this was merely the first act of a multi-part production. We kept our event to 30 minutes, which has been a hallmark of all our webinars. We began with a review of what IP MarketPlace is, how it works, and why it’s useful. We then proceeded to a ... » read more

More Online Technology

By Mike Gianfagna - 18 Dec, 2014 - Comments: 0

Got that family member who is really hard to shop for? Expecting a last-minute rush to the mall to find that unique one-of-a-kind gift? eSilicon has great news for you. Everyone knows that at least half of every chip contains on-board memory and now you can shop for that special someone by browsing eSilicon’s large selection of semiconductor memory IP. We launched the IP MarketPlace envir... » read more

The People Have Spoken, The Future Is Now

By Mike Gianfagna - 20 Nov, 2014 - Comments: 0

Last month, I mentioned we’d be doing a webinar to assess the impact of online capabilities in the semiconductor industry. On November 12th “Semiconductors Go Online and Worldwide” was broadcast. Bill Brennan from Credo Semi, Trevor Hiatt from IDT and Mahesh Tirupattur from Analog Bits joined us to share their experiences using eSilicon’s MPW and GDSII quoting portals. I have to ... » read more

Changing The World, One Transaction At A Time

By Mike Gianfagna - 23 Oct, 2014 - Comments: 0

It’s the season for foundry seminars. A few weeks ago, eSilicon exhibited at the TSMC Open Innovation Platform event in San Jose. This week, we were at the GLOBALFOUNDRIES Technical Seminar, also in San Jose. I talked with a lot of folks during both events – recited the elevator pitch many times (“who is eSilicon?”). Everybody has attention deficit disorder on a tradeshow floor. Fast ex... » read more

I Have Seen The Future

By Mike Gianfagna - 25 Sep, 2014 - Comments: 0

We recently concluded an online survey that measured design challenges and general sentiment regarding how they can be addressed, with some specific forward-looking queries. The title of the survey was “Big Data, the Cloud and Internet of (Silicon) Things.” We essentially asked our survey respondents to look into the future. We got an excellent response to this survey, with lots of thoughtf... » read more

2.5/3D IC – Do We Have Liftoff?

By Mike Gianfagna - 24 Jul, 2014 - Comments: 2

The challenges of Moore’s law scaling at advanced technolgy nodes are well documented. I won’t repeat them here. The benefits of “more than Moore” scaling (i.e., 2.5D and 3D ICs) are also well-known. This technology has shown great promise to provide an alternate path for large-scale integration. The technology has seen a lot of research effort, infrastructure support, standards develop... » read more

Semiconductor Self-Service: The Next Wave

By Mike Gianfagna - 26 Jun, 2014 - Comments: 0

The Internet is a marvelous invention. We all know it can bring a universe of human knowledge to our desktop. Thanks to some clever technology produced by some very successful companies, you also can browse all this information in real time, learning and discovering all the way. This ability to learn and discover is particularly interesting from a business perspective. It has created a truly... » read more

The Fading Art of Person-to-Person Communication

By Mike Gianfagna - 24 Apr, 2014 - Comments: 0

Have you ever sat in your cube at work and received an email from the person sitting next to you? Have you watched your kids text their friends when they’re all in the same room? Face it, typing is replacing talking. All this always-on technology is contributing to the demise of simple, person-to-person communication. I sometimes wonder if future generations of well-to-do people will hire pro... » read more

Self-Service Semiconductors

By Mike Gianfagna - 27 Mar, 2014 - Comments: 1

The era of self-service is here. Whether you’re in a restaurant, shopping center, airport or cruising the Web, you have more options than ever to browse, research, choose and transact business with little to no human interaction. Self-service isn’t a new concept. In fact, it’s been around a long time. What is new is the pervasive use of high-tech automation to deliver experiences t... » read more

Ticket to Ride

By Mike Gianfagna - 30 Jan, 2014 - Comments: 0

Welcome to the newly named eSilicon blog. We’ll discuss topics of general interest related to the semiconductor industry here. Our blog title does however take us off the hook to have complete, rational and defensible points of view at all times. Let’s begin… Do you like a roller coaster ride? Some do and some, well, get sick at the thought. I’m here to tell you that if you’re invo... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

category: Semi Thoughts

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