category: Whitepapers

category: IoT, Security & Automotive

A Method To Quickly Assess The Analog Front-End Performance In Communication SoCs
By Synopsys - 05 Nov, 2014 - Comments: 0

This white paper outlines a simplified method to determine if the electrical characteristics of any given AFE are adequate for the targeted application such as broadband signal transceivers in the context of wireless or wireline connectivity, cellular communications and digital TV and radio broadcast. Additionally, it illustrates a tool to explore tradeoffs between relative performance and oper... » read more

When To Use Simulation, When To Use Emulation
By Mentor, a Siemens Business - 22 Oct, 2014 - Comments: 0

Should you emulate or simulate? In this brief historical review, Dr. Lauro Rizzatti compares the two and reveals when to use which and explains why only emulation can verify embedded SW in an SoC design. To read more, click here. » read more

Extending Digital Verification Techniques For Mixed-Signal SoCs With VCS AMS
By Synopsys - 22 Oct, 2014 - Comments: 0

The growth in mixed-signal system-on-chip (SoC) designs is driven by many factors, including cost, performance and power consumption. This is fueled by many industry segments, including mobile communication, automotive, imaging, medical, networking and power management. The convergence of analog and digital blocks within the same die is driving the need for SoC design teams to adopt new verific... » read more

Top 10 Ways To Automate Verification
By Cadence - 22 Oct, 2014 - Comments: 0

It’s a persistent theme: engineers are expected to do more with the same or fewer resources. Meantime, designs continue to grow larger and more complex. Studies have shown that verification continues to consume up to 70% of the IC development cost in each advanced node. Cadence’s R&D teams designed the latest version of the Incisive® functional verification platform with these pressures in... » read more

The Impact Of 14nm Photomask Uncertainties On Computational Lithography Solutions
By Mentor, a Siemens Business - 16 Oct, 2014 - Comments: 0

Computational lithography solutions rely upon accurate process models to faithfully represent the imaging system output for a defined set of process and design inputs. These models, in turn, rely upon the accurate representation of multiple parameters associated with the scanner and the photomask. While certain system input variables, such as scanner numerical aperture, can be empirically tuned... » read more

An Introduction To The ARM mbed IoT Device Platform
By Arm - 08 Oct, 2014 - Comments: 0

The Internet of Things (IoT) is the collection of billions of end devices, from the low-power constrained end nodes to gateways, intelligently connected to cloud applications and services. Interoperability between devices and cloud services across market segments is needed to unleash the full potential of the IoT. The ARM Cortex-M processors family, the world’s leading 32-bit MCU which shi... » read more

Pushing The Performance Boundaries Of ARM Cortex-M Processors For Future Embedded Design
By Cadence - 08 Oct, 2014 - Comments: 0

One of the toughest challenges in the implementation of any processors is balancing the need for the highest performance with the conflicting demands for lowest possible power and area. Inevitably, there is a tradeoff between power, performance, and area (PPA). This paper examines two unique challenges for design automation methodologies in the new ARM Cortex-M processor: How to get maximum per... » read more

System-Aware SoC Power, Noise And Reliability Sign-off
By Ansys - 08 Oct, 2014 - Comments: 0

In globally competitive markets for mobile, consumer and automotive electronic systems, the critical success factors are power consumption, performance and reliability. To manage these conflicting requirements, design teams consider multiple options, including the use of advanced process technology nodes — especially FinFET-based devices. These advanced technology nodes allow chips to operate... » read more

Single Kernel Electro-Thermal IC Simulator
By Mentor, a Siemens Business - 08 Oct, 2014 - Comments: 0

This paper investigates a new, highly-accurate and high-performing electro-thermal effects simulation method and tools. It describes the extension of an analog electrical simulator to handle the electrical network and the thermal network simultaneously. These innovations remove the constraint on the time constants and allow accurate validation of the electro-thermal behavior for even the most a... » read more

Meeting The USB IP Requirements Of SoC Designs From 180-nm To 14/16nm FinFET
By Synopsys - 08 Oct, 2014 - Comments: 0

The ubiquitous USB standard provides data and charging capabilities to a multitude of consumer and enterprise products. USB’s ease-of-use and wide availability is belied by USB IP designers’ technical innovations. Without these innovations, USB could not be enabled in a broad range of process technologies ranging from 180-nm to the latest 14/16-nm FinFET technologies. This white paper ad... » read more

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