Beyond Chip Card Migration


Payment card usage is on the rise globally and with it the adoption of smart card technology. Globally, cards remain the preferred non-cash payment instrument with a market share of more than 55%. Consider that even during the height of the financial crisis from 2008 to 2009 transaction volumes on debit and credit cards were still increasing by nearly +10% (compared to +15% from 2007 to 2008). ... » read more

Secure SoC Manufacturing


As mobile usage continues to permeate daily lives with increasingly sensitive data and high-value transactions, the importance of device security has become even more important. Information security begins at the point when Internet- connected devices are designed and manufactured. But today’s complex global supply chains are fraught with numerous challenges that can result in both security b... » read more

Efficient Noise Analysis For Complex Non-Periodic Analog/RF Blocks


Noise minimization is a required design objective for advanced analog and RF circuits. Unlike digital circuits, where noise is a second-order effect, noise in analog and RF circuits directly affects system performance metrics such as signal to noise ratio (SNR) and bit error rate (BER). Effective design optimization in the presence of random device noise is challenging because the noise sources... » read more

Using VDKs For Automotive Systems Development


The software content of automotive systems found in powertrain, chassis, safety, body and advanced driver assistance systems (ADAS) application is increasing. At the same time, the pressure to accelerate development time lines, improve reliability and maintain/reduce costs is also increasing. Automotive OEM, Tier 1 and semiconductor companies involved in embedded software development, integrati... » read more

Root Cause Deconvolution


Scan logic diagnosis turns failing test cycles into valuable data and is an established method for digital semiconductor defect localization. The advent of layout-aware scan diagnosis represented a dramatic advance in diagnosis technology because it reduces suspect area by up to 85% and identifies physical net segments rather than entire logic nets [1-3]. The defect classifications provided by ... » read more

Low-Power, High-Performance Memory Systems


Mobile devices and their demand for rapid innovation have fundamentally and forever changed the semiconductor industry. These devices have fueled tremendous innovation in the last few years to bring about drastic improvements in performance, power and cost efficiency. They also demand condensed product development cycles, which accelerate the rate and need for innovation. The only thing that ha... » read more

System-Aware SoC Power, Noise And Reliability Sign-off


In globally competitive markets for mobile, consumer and automotive electronic systems, the critical success factors are power consumption, performance and reliability. To manage these conflicting requirements, design teams consider multiple options, including the use of advanced process technology nodes — especially FinFET-based devices. These advanced technology nodes allow chips to operate... » read more

Internet of Things Design Considerations For Embedded Connected Devices


Embedded connectivity has been around since the early days of M2M. But what is new are the many complexities and emerging standards embedded system developers need to know if they are to design the latest IoT device. This paper delves into many of the key considerations developers need to know and discusses the critical areas of IoT security and connectivity along with the importance of a prove... » read more

Building An Efficient, Tightly-Coupled Embedded System Using An Extensible Processor


The increasing demand for better filtering and processing capabilities of the processor within embedded systems results in a trend to shift from 8-bit microcontroller tightly coupled embedded systems towards 32-bit processor bus-based embedded systems. As a consequence, the power, performance and area (PPA) ratio of these systems also shifts in favor of performance at the cost of power and area... » read more

CEVA Targets Wearables


Coinciding with the announcement of an integrated platform based on a single TeakLite-4 DSP, handling Audio/Voice, Sensor Fusion, always-on UI and Connectivity- Linley Group Mobile Chip Report, By Linley Gwennap (May 5, 2014) describes how CEVA’s new and ground breaking platform is a starter kit of hardware and software blocks that a company can use to build a processor for its wearable produ... » read more

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