category: Whitepapers

category: IoT, Security & Automotive

Heterogeneous Multi-Processing Solution
By Arm - 11 Jun, 2014 - Comments: 0

With an increasing need for higher performance in mobile devices, the battery capacity must be increased accordingly, which is not easy because of the small size of mobile devices. Therefore, the demand for better power efficiency of mobile devices, which im- plies lower power consumption and higher performance is becoming critical. Recently, big.LITTLE architecture was introduced to fulfill th... » read more

Mobile Device Security
By Rambus - 05 Jun, 2014 - Comments: 0

As the functionality of mobile devices has increased, so have the threats. These devices make attractive targets, given the sensitivity of user and corporate data they process and store, their emerging use for viewing protected content and conducting sensitive banking and payment transactions. Until recently, hardware and software based defenses for mobile platforms lagged behind those found in... » read more

FinFET And Multi-Patterning Aware Place And Route Implementation
By Mentor, a Siemens Business - 21 May, 2014 - Comments: 0

The use of finFETs and multi-patterning has a huge impact on the entire physical implementation flow. This paper outlines the new challenges in placement, routing, optimization, and physical verification and describes how the Olympus-SoC place and route system handles them. To view this white paper, click here. » read more

Using Virtual Prototypes To Address The Growing Software Complexity In Automotive
By Synopsys - 21 May, 2014 - Comments: 0

The software content is growing steadily across multiple applications and the automotive market is no exception to this. In fact the amount of electronics and software in cars is transforming the way we perceive the value of a car. With this steady increase in software also comes the need to handle the amount and the complexity of all these different software stacks. And unlike other applicatio... » read more

Divide And Conquer: Hierarchical DFT For SoC Designs
By Mentor, a Siemens Business - 14 May, 2014 - Comments: 0

Large System on Chip (SoC) designs present many challenges to all design disciplines, including design-for-test (DFT). By taking a divide-and-conquer approach to test, significant savings in tool runtime and memory consumption can be realized. This whitepaper describes the basic components of a hierarchical DFT methodology, the benefits that it provides, and the tool automation that is availabl... » read more

Power Management Techniques For Smart Grid Devices
By Various Writers - 07 May, 2014 - Comments: 0

Energy efficiency is a top concern among developers building connected devices for the smart grid. Initially, the application-centric approach to building a device was used. But today, with sophisticated hardware power management features available on most modern processors, this is no longer the case. What’s needed is an OS-level approach that allows developers to take advantage of the full ... » read more

big.LITTLE Technology: The Future of Mobile
By Various Writers - 07 May, 2014 - Comments: 0

With the evolution from the first mobile phones through smartphones to today’s superphones and tablets, the demand for compute performance in mobile devices has grown at an incredible rate. Today’s devices need to service smarter and more complex interactions, such as voice and gesture control, combined with seamless and reliable content delivery. Gaming and user interfaces have also grown ... » read more

System-Aware SoC Power, Noise And Reliability Sign-off
By Various Writers - 07 May, 2014 - Comments: 0

In globally competitive markets for mobile, consumer and automotive electronic systems, the critical success factors are power consumption, performance and reliability. To manage these conflicting requirements, design teams consider multiple options, including the use of advanced process technology nodes — especially FinFET-based devices. These advanced technology nodes allow chips to operate... » read more

Model Extraction And Circuit Simulation Approaches For Successful SSO Analysis Of Chip-Package-Board Systems
By Various Writers - 07 May, 2014 - Comments: 0

This paper concerns guidelines to support successful SSO analysis for Chip-Package- Board systems. The procedures detailed address extraction and circuit simulation application of high node-count (N>100) frequency domain models. The focus of this paper is the low frequency portion, including DC, of the spectrum for broadband S- parameters. Frequency domain model extraction options and transient... » read more

Ultra Low Power Integrated Platform For Connectivity And Audio/Voice/Sensing
By Various Writers - 07 May, 2014 - Comments: 0

A look at an integrated approach on a single DSP and why it's needed. To download this white paper, click here. » read more

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