Systems & Design

FinFET And Multi-Patterning Aware Place And Route Implementation

A look at the physical challenges in advanced semiconductor designs and what to do about them.


The use of finFETs and multi-patterning has a huge impact on the entire physical implementation flow. This paper outlines the new challenges in placement, routing, optimization, and physical verification and describes how the Olympus-SoC place and route system handles them.

To view this white paper, click here.

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