3 Types Of AI Hardware


As AI chips become more pervasive, three primary approaches are moving to the forefront. Bradley Geden, director of product marketing at Synopsys, looks at how to take advantage of repeatability, what the different flavors look like, the difference between flat and hierarchical design, and what impact black-box arrays have on programmability. » read more

Speeding Up FPGA Development


Salaheddin Hetalani, field application engineer at OneSpin Solutions, talks about why it’s getting harder to design and debug FPGAs, how much design time can be saved through formal techniques, and why just relying on programmability isn’t the most efficient approach. » read more

Automotive Chip Design Workflow


Stewart Williams, senior technical marketing manager at Synopsys, talks about the consolidation of chips in a vehicle and the impact of 7/5nm on automotive SoC design, how to trade off power, performance, area and reliability, and how ISO 26262 impacts those variables. » read more

Dealing With ECOs In Complex Designs


Namsuk Oh, R&D principal engineer at Synopsys, talks about the impact of more corners and engineering change orders, how that needs to be addressed in the flow to close timing, and how dependencies can complicate any changes that are required. » read more

Distributed Design Implementation


PV Srinivas, group director for R&D at Synopsys, talks about the impact of larger chips and increasing complexity on design productivity, why divide-and-conquer doesn’t work so well anymore, and how to reduce the number of blocks that need to be considered to achieve faster timing closure and quicker time to market. » read more

Visually Assisted Layout In Custom Design


Avina Verma, group director for R&D in Synopsys’ Design Group, explains why visual feedback and graphical guidance are so critical in complex layouts, particularly for mixed-signal environments. » read more

Place And Route Made Easier And Faster


By Allan Crone A predictable trend in IC design is the ever-increasing size and complexity of designs while keeping the time allocated for the projects the same or shorter. Along with the tape-out pressure, organizations need to find cost savings everywhere possible. Lowering the overall cost of ownership of EDA tools is a viable way to manage the design budget. Consequently, design teams ar... » read more

Automation And Correct By Construction Will Empower 3D-IC Adoption


When research on 3D ICs was in full swing around 2009, I had been researching on how through-silicon-via (TSV) was related to thermal in a semiconductor chip-making company, and it seemed logical that 3D ICs would become mainstream. However, during the past 10 years, use of 3D stacked die has been applied to only a few applications, such as memory or image sensors, and the 2.5D solution using i... » read more

The Rising Importance Of Design Planning


Design Planning is often overlooked in the chip design flow. The front-end designer carefully architects the design functionality to produce golden RTL. This is then poured into the synthesis engine to produce logic gates. The synthesized netlist is then thrown over the wall by the front-end designer for physical implementation. The back-end designer receives a gate-level netlist, timing con... » read more

Fusion Compiler Unified Physical Synthesis


This white paper discusses how Fusion Compiler's unified physical synthesis optimization technologies addresses the time-to-market pressure and delivers the quality of results required for advanced process node leading-edge designs. Also learn about how unified physical synthesis seamlessly shares technologies and common engines between synthesis and place-and-route domains to deliver the best ... » read more

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