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Tape Out On Time With Demand Signoff DRC In P&R


Physical characteristics of devices have become progressively more complex even as design companies pack more devices on each die. Combining these characteristics with ever more demanding chip power, performance, and area (PPA) goals not only result in increased resource utilization but also challenge existing tools/flows/techniques. Adding on-demand signoff-quality DRC verification inside P&R ... » read more

Signoff DRC In P&R Lets You Get Better Products To Market Faster


Trust is generally a reflection of quality. You trust someone, be it an individual or a company, because they have, over time, consistently performed high-quality work. You trust a product because your past experience with that product has been positive, or the experiences of lots of other people have been positive. With that said, quality comes in shades and percentages. Most of us will happil... » read more

MaxLinear And Calibre RealTime Digital


MaxLinear implemented the Calibre RealTime Digital interface for fast, iterative, signoff DRC checking and fixing during floorplanning and placement. They not only reduce the total of batch DRC iterations, but also eliminate potential late-stage issues during final physical verification signoff that are exponentially harder to fix. Adopting the Calibre RealTime Digital interface enabled MaxLine... » read more

Optimizing Tool Integration Is Essential To Design Success


By James Paris and Armen Asatryan The relationship between a place and route (P&R) application and the collection of system-on-chip (SoC) design implementation, analysis, and verification methodologies and tools has always been very much a two-way street. The P&R system is the base, if you will, of design implementation—it takes the virtual and makes it physical. However, it is use... » read more

3 Types Of AI Hardware


As AI chips become more pervasive, three primary approaches are moving to the forefront. Bradley Geden, director of product marketing at Synopsys, looks at how to take advantage of repeatability, what the different flavors look like, the difference between flat and hierarchical design, and what impact black-box arrays have on programmability. » read more

Speeding Up FPGA Development


Salaheddin Hetalani, field application engineer at OneSpin Solutions, talks about why it’s getting harder to design and debug FPGAs, how much design time can be saved through formal techniques, and why just relying on programmability isn’t the most efficient approach. » read more

Automotive Chip Design Workflow


Stewart Williams, senior technical marketing manager at Synopsys, talks about the consolidation of chips in a vehicle and the impact of 7/5nm on automotive SoC design, how to trade off power, performance, area and reliability, and how ISO 26262 impacts those variables. » read more

Dealing With ECOs In Complex Designs


Namsuk Oh, R&D principal engineer at Synopsys, talks about the impact of more corners and engineering change orders, how that needs to be addressed in the flow to close timing, and how dependencies can complicate any changes that are required. » read more

Distributed Design Implementation


PV Srinivas, group director for R&D at Synopsys, talks about the impact of larger chips and increasing complexity on design productivity, why divide-and-conquer doesn’t work so well anymore, and how to reduce the number of blocks that need to be considered to achieve faster timing closure and quicker time to market. » read more

Visually Assisted Layout In Custom Design


Avina Verma, group director for R&D in Synopsys’ Design Group, explains why visual feedback and graphical guidance are so critical in complex layouts, particularly for mixed-signal environments. » read more

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