category: Whitepapers

category: IoT, Security & Automotive

DSP-Based Testing
By Various Writers - 16 Apr, 2014 - Comments: 0

ADC and DAC are the most typical mixed signal devices. In mixed signal testing, analog stimulus signal for an ADC is generated by an arbitrary waveform generator (AWG) which employs a D/A converter inside, and an analog signal out of a DAC is measured by a digitizer or a sampler which employs an A/D converter inside. The stimulus signals for these devices are created using mathematical method, ... » read more

Mask Hotspots Are Escaping The Mask Shop
By Various Writers - 16 Apr, 2014 - Comments: 0

Although the overwhelming majority of wafer production issues at the 28nm-and- below process nodes are lithography- and OPC-related, the semiconductor industry is starting to see problems caused by mask hotspots: wafer-level production issues that are caused when the shapes specified by optical proximity correction (OPC) are not faithfully reproduced on the mask. Mask hotspots will account for ... » read more

Advanced Dynamic Power Reduction Techniques
By Various Writers - 09 Apr, 2014 - Comments: 0

Rapid changes in SoC power issues have forced a rethinking of methodologies throughout the design flow to account for power-related effects. At 65 nanometer process nodes and below, leakage power and dynamic power consumption make it increasingly difficult to meet power budgets. Achieving timing and signal integrity closure is now tightly coupled with power optimization and power net distributi... » read more

Power Delivery Network Verification Coverage
By Various Writers - 09 Apr, 2014 - Comments: 0

This paper presents a methodology for comprehensive power grid verification coverage, including identification of power grid weaknesses early in the design cycle. To view this white paper, click here. » read more

Reliability In Networking And Telecom Systems
By Various Writers - 09 Apr, 2014 - Comments: 0

The main source of heat in electronic equipment is their semiconductor chips, and the temperature sensitivities of these chips presents a challenge in designing cooling solutions. Overheating causes the chips to prematurely fail—and failure of only one chip can disable the entire equipment, the higher the chip temperature, the earlier and more certain the failure. As functionality has increas... » read more

MIMO Maximum Likelihood Detector
By Various Writers - 09 Apr, 2014 - Comments: 0

MIMO (Multiple Input and Multiple Output) is one of the leading approaches for improving data rates and/or SNR (Signal to Noise Ratio). By using multiple receive and transmit antennas, MIMO can exploit the diversity of the wireless channel. This is then used to increase the spectral efficiency of the channel and improve the data rates for any given channel bandwidth. This white paper reviews... » read more

Post-Silicon Validation Using Formal Analysis
By Various Writers - 09 Apr, 2014 - Comments: 0

Verifying the current generation of complex SoCs requires the best methodology and tools, including the application of high-capacity formal verification technologies throughout the design flow, from architectural exploration to post-silicon debug. We see this last area, post-silicon debug, as an important value delivered by formal technology for design and verification teams who have not employ... » read more

RF Periodic Stability Analysis
By Various Writers - 09 Apr, 2014 - Comments: 0

The PSTB (periodic stability) analysis feature in Cadence Spectre RF Simulation Option performs stability analysis for circuits with periodically time-varying operating points. PSTB is the periodic equivalent of linear stability (STB) analysis in that it calculates the small-signal loop gain, gain margin, and phase margin around a periodic operating point. PSTB is useful in applications such as... » read more

Porting To ARM 64-Bit
By Various Writers - 09 Apr, 2014 - Comments: 0

Why 64-bit? It seems that is a question with many answers! For some, it will be the need to address more than 4GB of memory, for others the need for wider registers and greater accuracy of 64-bit data processing, for still others the attraction of a larger register set. Whatever your reason for looking to move to 64-bit, it is likely that you will have a body of legacy software which will ne... » read more

New Product Introduction Process For Heterogeneous 2.5D Devices
By Javier DeLaCruz - 28 Mar, 2014 - Comments: 0

For the past few years, the most popular topics in the 2.5D space have been: The design tools Foundry processes for through-silicon vias, temporary bonding and bump architecture The assembly process, such as what is first bonded to what The industry is at the point where the open variables on these topics are narrowing, and other critical aspects need to get far better attention. The... » read more

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