category: Videos

category: IoT, Security & Automotive

Multi-Physics At 5/3nm
By Ed Sperling - 11 Apr, 2019 - Comments: 0

Joao Geada, chief technologist at ANSYS, talks about why timing, process, voltage, and temperature no longer can be considered independently of each other at the most advanced nodes, and why it becomes more critical as designs shrink from 7nm to 5nm and eventually to 3nm. In addition, more chips are being customized, and more of those chips are part of broader systems that may involve an AI com... » read more

GDDR6 – HBM2 Tradeoffs
By Ed Sperling - 10 Apr, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, talks about why designers choose one memory type over another. Applications for each were clearly delineated in the past, but the lines are starting to blur. Nevertheless, tradeoffs remain around complexity, cost, performance, and power efficiency.   Related Video Latency Under Load: HBM2 vs. GDDR6 Why data traffic and bandw... » read more

2.5D, 3D Power Integrity
By Ed Sperling - 14 Mar, 2019 - Comments: 0

Chris Ortiz, principal applications engineer at ANSYS, zeroes in on some common issues that are showing up in 2.5D and 3D packaging, which were not obvious in the initial implementations of these packaging technologies. This includes everything from how to build a power delivery network to minimize the coupling between chips to dealing with variability and power integrity and placement of diffe... » read more

Boosting Analog Reliability
By Ed Sperling - 17 Jan, 2019 - Comments: 0

Aveek Sarkar, vice president of Synopsys’ Custom Compiler Group, talks about challenges with complex design rules, rigid design methodologies, and the gap between pre-layout and post-layout simulation at finFET nodes. https://youtu.be/JRYlYJ31LLw » read more

Tightening Margins On Heat
By Ed Sperling - 17 Jan, 2019 - Comments: 0

Stephen Crosher, CEO of Moortec, talks with Semiconductor Engineering about the impact of more accurate measurements on power, performance and reliability of designs from 40nm all the way down to 3nm. https://youtu.be/VnX-TiaMVmI » read more

Making Sense Of DRAM
By Ed Sperling - 13 Dec, 2018 - Comments: 0

Graham Allan, senior manager for product marketing at Synopsys, examines the different types of DRAM, from GDDR to HBM, which markets they’re used in, and why there is such disparity between them. https://youtu.be/ynvcPfD2cZU     __________________________________ See more tech talk videos here. » read more

Hybrid Memory
By Ed Sperling - 13 Sep, 2018 - Comments: 0

Gary Bronner, senior vice president of Rambus Labs, talks about the future of DRAM scaling, why one type of memory won’t solve all needs, and what the pros and cons are of different memories. https://youtu.be/R0hhDx2Fb7Q » read more

Huge Performance Gains Ahead
By Ed Sperling - 30 Aug, 2018 - Comments: 0

Rambus Chief Scientist Craig Hampel talks about what will drive the next big performance gains after Moore’s Law, from the data center to the edge. https://youtu.be/ItHCsei7YTc » read more

UPF-Aware Clock-Domain Crossing
By Ed Sperling - 29 Aug, 2018 - Comments: 0

Synopsys’ Namit Gupta talks with Semiconductor Engineering about low-power design techniques at the most advanced process nodes, including how to verify the impact of CDC on power at the register transfer level, how to avoid bugs caused by the post-RTL insertion of low-power devices such as isolation, retention and level shifters. https://youtu.be/HwRe9DHLfmg » read more

Aging Effects
By Ed Sperling - 17 Jul, 2018 - Comments: 0

Tech Talk: Fraunhofer EAS' group manager for quality and reliability, Andre Lange, talks about how to model aging effects and why the problems are becoming more difficult at advanced nodes. https://youtu.be/XHWww2PE7aY » read more

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