Why process, voltage and temperature are so interrelated at future nodes, and what impact that has on design.
Joao Geada, chief technologist at ANSYS, talks about why timing, process, voltage, and temperature no longer can be considered independently of each other at the most advanced nodes, and why it becomes more critical as designs shrink from 7nm to 5nm and eventually to 3nm. In addition, more chips are being customized, and more of those chips are part of broader systems that may involve an AI component or advanced packaging, which makes multi-physics analysis essential.
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