Where the next boosts will come from and why.
Rambus Chief Scientist Craig Hampel talks about what will drive the next big performance gains after Moore’s Law, from the data center to the edge.
Companies battle it out to get artificial intelligence to the edge using various chip architectures as their weapons of choice.
Bulk CMOS, FD-SOI and finFETs all on tap as big players vie for differentiation. But where will chipmakers go after 28nm?
Consortiums seek ways to ensure interoperability of hardened IP as way of cutting costs, time-to-market, but it’s not going to be easy.
No shortage of alternatives as materials, packaging and architectural options grow, and plenty of startups are jumping in.
Applied Materials circles market as demand for next-gen technology grows.
Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.
Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful.
Slowdown due to impact on timing, and dependencies between power, thermal and timing that may not be caught by signoff tools.
Old solutions don’t necessarily work anymore, particularly at advanced nodes and ultra-low voltage.
Stacking die is garnering more attention, but design flows aren’t fully ready to support it.
Understanding aging factors within a design can help reduce the likelihood of product failures.
How Arm sees its role in emerging segments of tomorrow’s compute challenges.
New data flow, higher switch density and IP integration create issues across the design flow.
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