Where the next boosts will come from and why.
Rambus Chief Scientist Craig Hampel talks about what will drive the next big performance gains after Moore’s Law, from the data center to the edge.
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Why the chip industry is plowing ahead with advanced packaging and what can be done to improve it.
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Interests: System-Level Design Low Power-High Performance Manufacturing, Packaging & Materials Test, Measurement & Analytics IoT, Security & Automotive
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