Cataloging IP In The Enterprise


Many companies have no way of documenting where IP they license is actually used, which version of that IP is being utilized, and whether that license extends to other projects or even to their customers. Pedro Pires, applications engineer at ClioSoft, looks at how IP currently is cataloged, why it’s been so difficult to do this in the past, and how AI can be used to speed up and simplify thi... » read more

Next-Gen Transistors


Nanosheets, or more generally, gate-all-around FETs, mark the next big shift in transistor structures at the most advanced nodes. David Fried, vice president of computational products at Lam Research, talks with Semiconductor Engineering about the advantages of using these new transistor types, along with myriad challenges at future nodes, particularly in the area of metrology. » read more

Why Traceability Matters


More heterogeneous and increasingly dense chip designs make it much harder to stay on track with initial specifications. Paul Graykowski, senior technical marketing manager at Arteris IP, talks about matching requirements to the design, the impact of ECOs and other last-minute changes, and best practices for managing revisions. » read more

The Ethernet Evolution


Ethernet was expected to be long gone by now, but predictions of its demise were decades premature. John Swanson, senior product marketing manager for high-performance computing digital IP at Synopsys, talks about how Ethernet has evolved over the past 45 or so years from a somewhat “boring” technology to one that is at the forefront of data center performance improvements, with more update... » read more

Design Technology Co-Optimization


Rising complexity is making it increasingly difficult to optimize chips for yield and reliability. David Fried, vice president of computational products at Lam Research, examines the benefits of automated rules to manage the relationship between layout and design requirements on one side, and process flows and rules/checks on the other. Benefits include reduced margin, shortened time to market,... » read more

The Risk Of Losing Track Of Your IP


What happens when you misuse IP, intentionally or otherwise? Pedro Pires, applications engineer at Cliosoft, talks about the challenges of keeping track of IP across multiple chip design projects, which can grow to include dozens of third-party IP blocks, last for long periods of years, and span multiple continents. » read more

Always-On DSPs


There are tradeoffs between powering circuits down to save power and waking them up to respond to voice and visual commands. Prakash Madhvapathy, director of product marketing and product management at Cadence, talks about the best ways to deploy digital signal processors, why multiple DSPs are often better than just one, and what penalties there are for various approaches. » read more

Radiation Hardening Chips For Outer Space


What’s the difference between radiation tolerant and radiation hardening, and where is each one used? Minal Sawant, director of the aerospace and defense vertical market at Xilinx, talks about different striations in the Earth’s atmosphere, how those various levels can affect radiation, and what impact that has on the functionality of increasingly dense chip circuits over extended periods o... » read more

Creating IoT Devices That Will Remain Secure


What’s secure today may not be secure in the future, and even if you include an IoT device with state-of-the-art security, it may be surrounded by less secure devices. Steve Hanna, distinguished engineer at Infineon, examines the impact of security on IoT adoption, why resilience across a system is the new target for secure designs, and how to minimize the impact of less secure devices. » read more

End-To-End Traceability


Despite standards such as ISO 26262 and IEC 61508, there are still disconnects and gaps in the supply chain and design-through-manufacturing flows. Kurt Shuler, vice president of marketing at Arteris IP, digs into what's missing, why changes made in one area are not reflected in other areas and throughout the product lifecycle, and why various different phases of the flow don't always match up ... » read more

← Older posts Newer posts →