Access to dies or chiplets is problematic, but a new standard may help.
Disaggregating SoCs allows chipmakers to cram more features and functions into a package than can fit on a reticle-sized chip. But as Vidya Neerkundar, technical marketing engineer at Siemens EDA explains, there are challenges in accessing all of the dies or chiplets in a package. The new IEEE 1838 standard addresses that, as well as what to do when 2.5D and 3D-ICs are combined together in the same package.
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Leave a Reply