category: Videos

category: IoT, Security & Automotive

Challenges At 3/2nm
By Ed Sperling - 15 Sep, 2020 - Comments: 0

David Fried, vice president of computational products at Lam Research, talks about issues at upcoming process nodes, the move to EUV lithography and nanosheet transistors, and how process variation can affect yield and device performance. » read more

AI Inference Acceleration
By Ed Sperling - 14 Sep, 2020 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about considerations in choosing an AI inference accelerator, how that fits in with other processing elements on a chip, what tradeoffs are involved with reducing latency, and what considerations are the most important. » read more

Memory Access In AI Systems
By Ed Sperling - 27 Jul, 2020 - Comments: 0

Memory access is a key consideration in AI system design. Ron Lowman, strategic marketing manager for IP at Synopsys, talks about how memory affects overall power consumption, why partitioning of on-chip and off-chip is so critical to performance and power, and how this changes from the cloud to the edge. » read more

eFPGAs Vs. FPGA Chiplets
By Ed Sperling - 22 Jul, 2020 - Comments: 0

Embedded FPGAs are a totally different concept from discrete FPGA chiplets, and that is reflected in size, cost, power and performance. Geoff Tate, CEO of Flex Logix, talks about which applications are best for each, how each maximizes power and performance, and why choices will vary greatly by application. Related eFPGA Knowledge Center FPGA Knowledge Center Increasing EFPGA Densit... » read more

Ins And Outs Of In-Circuit Monitoring
By Ed Sperling - 21 Jul, 2020 - Comments: 2

At 7nm and 5nm, in-circuit monitoring is becoming essential. Steve Crosher, CEO of Moortec, talks about the impact of rising complexity, how different use cases and implementations can affect reliability and uptime, and why measuring electrical, voltage and thermal stress can be used to statistically predict failures and improve reliability throughout a chip’s lifetime. » read more

3 Types Of AI Hardware
By Ed Sperling - 20 Jul, 2020 - Comments: 1

As AI chips become more pervasive, three primary approaches are moving to the forefront. Bradley Geden, director of product marketing at Synopsys, looks at how to take advantage of repeatability, what the different flavors look like, the difference between flat and hierarchical design, and what impact black-box arrays have on programmability. » read more

Increasing eFPGA Density
By Ed Sperling - 24 Jun, 2020 - Comments: 0

How to boost embedded FPGA density to the point where it is competitive with traditional FPGAs, at a lower cost and faster turnaround time. Geoff Tate, CEO of Flex Logix, talks about the importance of interconnects and standard cells in adding flexibility into chips, and why eFPGAs are suddenly gaining attention. » read more

Using ML In Manufacturing
By Ed Sperling - 23 Jun, 2020 - Comments: 0

How to prevent early life failures by applying machine learning to different use cases, and how to interpret models for different tradeoffs on reliability. Jeff David, vice president of AI solutions at PDF Solutions, digs down into how to utilize data to improve reliability. » read more

Different Levels Of Interconnects
By Ed Sperling - 17 Jun, 2020 - Comments: 0

The interconnect hierarchy from metal 0 in a semiconductor all the way up to racks of servers. Kurt Shuler, vice president of marketing at Arteris IP, explains why each one is different, and how every level can contribute to latency and performance. » read more

DAC 2020: Virtual And Different
By Ed Sperling - 08 Jun, 2020 - Comments: 0

Zhuo Li, group director at Cadence, and Harry Foster, chief scientist at Mentor, a Siemens Business, talk about the changes in content for this year's Design Automation Conference. » read more

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