Marvell's Sathya Subramanian talks with Semiconductor Engineering about the new 802.11ax wireless standard, how it will work with 5G and existing networks, and how to set up an integrated solution to reduce bottlenecks in the home and in the enterprise.
https://youtu.be/KZP59qw6j4Y » read more
Flex Logix’s Cheng Wang talks about which types of chips work best for neural networks, AI and machine learning.
https://youtu.be/k7OdP7B10o8 » read more
Synopsys’ Michael Jackson talks with Semiconductor Engineering about why it’s becoming necessary to fuse together various pieces of digital design.
https://youtu.be/AOWh4wjw-ps » read more
Brewer Science’s Dominic Miranda digs into printed electronics, why they’re becoming so important, what materials should be used, and how they can be targeted for specific applications in sensors and edge devices.
https://youtu.be/tN2goxrDCqA » read more
Namit Varma, senior director of Achronix’s India Technology Center, explains how to time an eFPGA, what can go wrong, what are the different clocking scenarios, and what impact variation has on the process.
https://youtu.be/Jq4XUKnniB4 » read more
eSilicon’s David Axelrad discusses the challenges with 56Gbps and 112Gps SerDes, and why the switch from analog to digital is required for performance and low power.
https://youtu.be/E-CU8TLvjjc » read more
OneSpin Solutions’ Muhammed Haque Khan, product specialist for synthesis verification, digs into equivalence checking in FPGA designs and what can go wrong with FPGA designs.
https://youtu.be/RFlP2Z_-Yqs » read more
Synopsys’ Manmeet Walia talks examines the impact of machine-to-machine traffic and why that requires some fundamental changes in networking architectures. Two key issues that need to be addressed are scalability and latency, which require new networking architectures.
https://youtu.be/2RIQt3QVPtE » read more
Jamie Shaeffer, senior director of product line management at GlobalFoundries, talks about how FD-SOI compares with bulk technologies, where it will be used and why, and future stacking options.
https://youtu.be/2i7GJRxcNRs » read more
Tech Talk: Melissa Grupen-Shemansky, CTO for SEMI’s FlexTech Group and Advanced Packaging program, looks at what’s changing now that Moore’s Law is slowing, and how packaging is changing as the traditional physical boundaries of electronics begin breaking down.
https://youtu.be/UpH1m8Oru90 » read more
Rising complexity is changing the way companies engage and interact, but long-standing barriers in communication, culture, and IP protection are slowing progress.
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.
Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.
eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.
The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?
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