Tech Talk: 14nm And Stacked Die


Aashish Malhotra, marketing director for the ASIC Business Unit at GlobalFoundries, talks about 14nm process technology, the IP ecosystem, and why that technology node will be used as a platform for 2.5D and 3D stacked die across a wide range of markets including the Internet of Everything. [youtube vid=ukTRuedB7ZU] » read more

Tech Talk: Configurable Logic


Cliff Lloyd, business development director at NXP Semiconductors, talks about designing in one part for many functions to reduce power consumption and cost. [youtube vid=ut5kCm0kNwE] » read more

Tech Talk: SoC Protocol Debug


Bernie DeLay, group director for verification IP R&D at Synopsys, talks about what goes wrong in complex SoCs, how so-called standard pieces play together, and where are the gotchas in re-use. [youtube vid=AaY_AmdjUpo] » read more

Tech Talk: Power Emulation


Jean-Marie Brunet, marketing director for Mentor Graphics' Emulation Division, talks about why hardware-assisted verification is now required for power and where it works best. [youtube vid=Mb63cbjbZ_I] » read more

Tech Talk: Sensor Design


NXP's Wouter Sijm talks about sensor design in the IoT age, where engineers can go astray, and why the IoT is a more complex environment for sensors than previous devices. [youtube vid=7fqEatgvZnE] » read more

Tech Talk: 10nm Patterning


David Abercrombie, advanced physical verification methodology program manager at Mentor Graphics, talks about triple and quadruple patterning after 20/16/14nm and what design teams need to understand to get this right. [youtube vid=7bjutPWakpw] » read more

Tech Talk: DDR4


Rambus' Ely Tsern digs into the challenges in integrating DDR4 compared with DDR3 and why it will get even more difficult over the next few iterations. [youtube vid=2M6vFweaZ-M] » read more

Tech Talk: 4K Screen Design


Hezi Saar, MIPI IP product manager at Synopsys, talks about how to design high-resolution displays for mobile devices and what can go wrong. [youtube vid=rQKNM0CABM0] » read more

Tech Talk: USB Type-C


NXP's Ravi Shah explains how to design in the new USB standard, what to watch out for and why it's going to be so important for mobile and connected devices. [youtube vid=iPCwpaPy1pw] » read more

Tech Talk: Wafer Plane Analysis


Leo Pang, executive vice president at D2S, talks about the problems of patterning at 40nm and below and how to deal with them more effectively using existing equipment. [youtube vid=FbRyhw2q3fE] » read more

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