Tech Talk: USB Type-C

By Ed Sperling - 30 Jul, 2015 - Comments: 1

NXP's Ravi Shah explains how to design in the new USB standard, what to watch out for and why it's going to be so important for mobile and connected devices. [youtube vid=iPCwpaPy1pw] » read more

Tech Talk: Wafer Plane Analysis

By Ed Sperling - 23 Jul, 2015 - Comments: 0

Leo Pang, executive vice president at D2S, talks about the problems of patterning at 40nm and below and how to deal with them more effectively using existing equipment. [youtube vid=FbRyhw2q3fE] » read more

Tech Talk: 22nm FD-SOI

By Ed Sperling - 13 Jul, 2015 - Comments: 0

Subramani Kengeri, vice president of global design solutions at GlobalFoundries, discusses the evolution of 22nm FD-SOI and its advantages, including single patterning in the middle end of line, 0.4 volt operating voltage, and how it compares to finFETs in terms of performance. [youtube vid=5fa1AcIGcUw] » read more

Tech Talk: Mesh Networks

By Ed Sperling - 06 Jul, 2015 - Comments: 0

Yifeng Zhang, director of systems at NXP, discusses problems in connecting home networks and how that's about to change with Bluetooth Low Energy and mesh networking approaches. [youtube vid=zcET06J2Z2k] » read more

Tech Talk: Power Tools

By Ed Sperling - 27 May, 2015 - Comments: 0

At 200 million gates, using standard tools for power will add weeks to the semiconductor design process. Vijay Chobisa, product marketing manager at Mentor Graphics, talks with Semiconductor Engineering about where the problems are and how to solve them. [youtube vid=w7yEdtaIb9A] » read more

Tech Talk: 14nm

By Ed Sperling - 21 May, 2015 - Comments: 0

Tamer Ragheb, digital design methodology technical lead at GlobalFoundries about what's changed with 14nm finFETs, including coloring with double patterning, new corners, Miller Effects, timing issues and variability. [youtube vid=Yk6jSKCtsjU] » read more

Tech Talk: Faster SPICE

By Ed Sperling - 04 May, 2015 - Comments: 0

ProPlus CTO Bruce McGaughy explains why FastSPICE (fast Simulation Program with Integrated Circuit Emphasis) is running out of steam in the finFET generation and what needs to happen next. [youtube vid=07XzUQxPUr8] » read more

Tech Talk: Virtual Prototyping

By Brian Bailey - 22 Apr, 2015 - Comments: 0

Bill Neifert, CTO of Carbon Design Systems, talks with about the intersection of IP and EDA, driven in particular by ARM's new architecture. [youtube vid=1OopYWmRarE] » read more

Tech Talk: Mobile Security (Part 2)

By Ed Sperling - 15 Apr, 2015 - Comments: 0

Simon Blake Wilson of Rambus' Cryptography Research Division talks about where security needs to fit into the design flow and where the biggest risks are. To view part one of this video, click here. [youtube vid=_nnniakpP3M] » read more

Tech Talk: Better Coverage

By Ed Sperling - 08 Apr, 2015 - Comments: 1

Atrenta's Yuan Lu talks about code coverage, functional coverage and the use of assertions in debugging designs. [youtube vid=Hpm-l1z8HTo] » read more

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category: Videos

category: IoT, Security & Automotive

Tech Talk: USB Type-C

Tech Talk: Wafer Plane Analysis

Tech Talk: 22nm FD-SOI

Tech Talk: Mesh Networks

Tech Talk: Power Tools

Tech Talk: 14nm

Tech Talk: Faster SPICE

Tech Talk: Virtual Prototyping

Tech Talk: Mobile Security (Part 2)

Tech Talk: Better Coverage

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