Chip Industry Technical Paper Roundup: August 13

MTJ-CRAM; photonics fabrication; energy-efficient PIM processors; reducing of dynamic IR drop; mitigating Rowhammer; attacks on 3DIC; semiconductor defect inspection.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Mechanically-flexible wafer-scale integrated-photonics fabrication platform MIT and NY CREATES
Experimental demonstration of magnetic tunnel junction-based computational random-access memory University of Minnesota and University of Arizona, Tucson
Survey of Deep Learning Accelerators for Edge and Emerging Computing University of Dayton and the Air Force Research Laboratory
A Hybrid ECO Detailed Placement Flow for Improved Reduction of Dynamic IR Drop UC San Diego
MINT: Securely Mitigating Rowhammer with a Minimalist In-DRAM Tracker Georgia Tech, Google, and Nvidia
Harnessing Heterogeneity for Targeted Attacks on 3DICs Drexel University
An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspection Imec and SCREEN SPE Germany

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