Chip Industry Technical Paper Roundup: Sept. 9

ECTC metrology report; microfludic cooling; Fano resonance in Si Photonics; enhancing transport properties of polymers; cooling power electronics; LLMs with scalable chiplets; large-scale sub-5nm vertical transistors.

popularity

New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics NIST, Binghamton University, and TechSearch International
Glacierware: Hotspot-aware Microfluidic Cooling for High TDP Chips using Topology Optimization Corintis
Piezoelectrically driven Fano resonance in silicon photonics Ghent University and imec
Hecaton: Training and Finetuning Large Language Models with Scalable Chiplet Systems Tsinghua University
Advances in Two-Phase Cooling for Power Electronics Converters ROMA TRE University, ENEA Casaccia Research Center and Sapienza University
Large-scale sub-5-nm vertical transistors by van der Waals integration Hunan University
Non-equilibrium transport in polymer mixed ionic–electronic conductors at ultrahigh charge densities Cambridge University, Grenoble Alpes University, CNRS, Humboldt-Universität zu Berlin, et al.

More Reading
Technical Paper Library home



Leave a Reply


(Note: This name will be displayed publicly)