tag: Binghamton University

Chip Industry Technical Paper Roundup: Nov. 25
By Linda Christensen - 25 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=386 /] » read more

Chip Industry Technical Paper Roundup: Sept. 9
By Linda Christensen - 09 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=354 /] More ReadingTechnical Paper Library home » read more

ECTC 2024 Session Readout: Advancement of Metrology
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A Electronic Components and Technology Conference (ECTC) session report titled "2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics" was published by NIST, Binghamton University, and TechSearch International. Abstract: "Metrology plays a pivotal role in semiconductor research, manufacturing, packaging and assembly. It is critical to the success of this... » read more

Research Bits: Nov. 28
By Jesse Allen - 28 Nov, 2023 - Comments: 0

Switchable photodetector and neuromorphic vision sensor Researchers from the Institute of Metal Research at the Chinese Academy of Sciences built a device that can be switched between being a photodetector and neuromorphic vision sensor by adjusting the operating voltage. The trench-bridged GaN/Ga2O3/GaN heterojunction array device exhibits volatile and non-volatile photocurrents at low and hi... » read more

Rethinking Engineering Education In The U.S.
By Karen Heyman - 11 May, 2023 - Comments: 8

The CHIPS Act, as well as the ongoing need for talent, is causing both industry and academia in America to rethink engineering education, resulting in new approaches and stronger partnerships. As an example, Arizona State University (ASU) now has a Secure, Trusted, and Assured Microelectronics Center (STAM). The center offers an interdisciplinary approach to learning secure and trusted semic... » read more

Research Bits: Feb. 6
By Jesse Allen - 06 Feb, 2023 - Comments: 0

Pillars for chiplet integration Researchers from the Tokyo Institute of Technology proposed a new chiplet integration technology called Pillar-Suspended Bridge (PSB), which they say is a simpler method of chip-to-chip connection compared to silicon interposers and redistribution layers. In the PSB, only a pillar-shaped metal structure called a "MicroPillar" is interposed at the connection b... » read more

Research Bits: Dec. 13
By Jesse Allen - 13 Dec, 2022 - Comments: 0

Electronic-photonic interface for data centers Engineers at Caltech and the University of Southampton integrated an electronic and photonic chip for high-speed communication in data centers. "There are more than 2,700 data centers in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and o... » read more

The Good, Bad And Unknowns Of Flexible Devices
By Ed Sperling - 27 Jan, 2021 - Comments: 0

Flexible hybrid electronics are beginning to proliferate in consumer, medical, and industrial applications due to their comparatively low weight, thin profile, and the ability to literally bend the rules of design. Open any smart phone today and you're likely to find one or more of these flexible boards. Unlike standard printed circuit boards, FHE devices are printed using a combination of r... » read more

Power/Performance Bits: Sept. 11
By Jesse Allen - 11 Sep, 2019 - Comments: 0

Thread transistor Researchers at Tufts University developed a thread-based transistor that can be fashioned into simple, all-thread based logic circuits and integrated circuits which could be woven into fabric or worn on the skin, or even surgically implanted. The thread-based transistor (TBT) is made of a linen thread coated with carbon nanotubes, creating a semiconductor surface. Two thin... » read more

Sorting Out Packaging Options
By Ed Sperling - 10 Sep, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Butler, executive vice president and general manager of SPTS Technologies; Ingu Yin Chang, senior vice president president at ASE Group; Hubert Karl Lakner, executive director of the Fraunhofer Institute for Photonic Microsystems; Robert Lo, division director for electronics and optoelectronics research at Industrial Te... » read more

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