Chiplets: Bridging The Gap Between The System Requirements And Design Aggregation, Planning, And Optimization


A technical paper titled “System and Design Technology Co-optimization of Chiplet-based AI Accelerator with Machine Learning” was published by researchers at Auburn University.


“With the availability of advanced packaging technology and its attractive features, the chiplet-based architecture has gained traction among chip designers. The large design space and the lack of system and package-level co-design methods make it difficult for the designers to create the optimum design choices. In this research, considering the colossal design space of advanced packaging technologies, resource allocation, and chiplet placement, we design an optimizer that looks for the design choices that maximize the Power, Performance, and Area (PPA) and minimize the cost of the chiplet-based AI accelerator. Inspired by the Bayesian approach for black-box function optimization, our optimizer guides the search space toward global maxima instead of randomly traversing through the search space. We analytically synthesize a dataset from the search space and train an ML model to predict the target value of our defined cost function at the optimizer-suggested points. The optimizer locates the optimum design choices from the specified search space (≥ 1M data points) with minimal iterations (≤ 200 iterations) and trivial run time.”

Find the technical paper here. Published: June 2023.

Mishty, Kaniz, and Mehdi Sadi. “System and Design Technology Co-optimization of Chiplet-based AI Accelerator with Machine Learning.” In Proceedings of the Great Lakes Symposium on VLSI 2023, pp. 697-702. 2023.


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