Survival Of The Cheapest?


We all want the best solution to win, but that rarely happens. History is littered with products that were superior to the alternatives and yet lost out to a lessor rival. I am sure several examples are going through your mind without me having to list them. It is normally the first to volume that wins, often accelerated by copious amounts of marketing dollar to help push it against headwinds. ... » read more

New Technologies To Support 3D-ICs


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

System Bits: July 30


A camera that sees around corners Researchers at Stanford University developed a camera system that can detect moving objects around a corner, looking at single particles of light reflected on a wall. “People talk about building a camera that can see as well as humans for applications such as autonomous cars and robots, but we want to build systems that go well beyond that,” said Gordon... » read more

Manufacturing Bits: June 25


Panel-level consortium Fraunhofer is moving forward with the next phase of its consortium to develop technologies for panel-level packaging. In 2016, Fraunhofer launched the original effort, dubbed the Panel Level Packaging Consortium. The consortium, which had 17 partners, developed various equipment and materials in the arena. Several test layouts were designed for process development on ... » read more

ECTC Packaging Trends


At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC packaging technologies. The event provided a glimpse of the future of packaging, which is becoming more important in the industry. At one time, IC packaging took a backseat in the semiconductor... » read more

Chiplet Momentum Builds, Despite Tradeoffs


Chip design is a series of tradeoffs. Some are technical, others are related to cost, competitive features or legal restrictions. But with the nascent 'chiplet' market, many of the established balance points are significantly altered, depending on market segments and ecosystem readiness. Chiplets provide an alternative mechanism for integrating intellectual property (IP) blocks into a semico... » read more

Raising The Abstraction Level For Power


Power-aware design is still a relatively new concern for many semiconductor products, and since inception it has changed several times and in different ways. Initially people were concerned about peak power. Today, they care about peak, total energy, thermal and other effects. The industry has tried several abstractions ranging from system-level analysis, which promised to swamp implementati... » read more

The Next Semiconductor Revolution


What will drive the next semiconductor revolution? When you ask people with decades of experience in semiconductor manufacturing and software development, the answers include everything from AI and materials to neuromorphic architectures. Federico Faggin, designer of the world's first microprocessor; Terry Brewer, president and CEO of Brewer Science; Sanjay Natarajan, corporate vice presi... » read more

Reducing Advanced Packaging Costs


Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Reliability, Machine Learning And Advanced Packaging


Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows ar... » read more

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