More Lithography/Mask Challenges


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Regina Freed, managing director of patterning technology at [getentity id="... » read more

Embedded Die Packaging Emerges


Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

Multiphysics Reliability Signoff For Next-Gen Auto Electronics Systems


The automotive industry is in the midst of a sea change. Growing market needs for electrification, connectivity on the go, advanced driver assistance systems, and ultimately the goal of autonomous driving, are creating newer requirements and greater challenges. A chassis on four wheels is now fitted with cameras, radar and other sensors, which will be the eyes of the driverless car, as well as ... » read more

Innovative Integration Solutions For SiP Packages Using Fan-Out Wafer Level eWLB Technology


Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduced overall form factor as well as cost effective... » read more

Follow The Moving Money


Semiconductor economics are changing by market, by region, and by product node and packaging type, adding new complexity into decisions about which technology to use for which products and why. Money is the common denominator in all of these decisions, whether it's measured by return on invested capital, quarterly profits, or long-term investments that can include acquisitions, organic growt... » read more

Predictions: Manufacturing, Devices And Companies


Some predictions are just wishful thinking, but most of these are a lot more thoughtful. They project what needs to happen for various markets or products to become successful. Those far reaching predictions may not fully happen within 2018, but we give everyone the chance to note the progress made towards their predictions at the end of the year. (See Reflection On 2017: Design And EDA and Man... » read more

Mixed Messages For Mixed-Signal


There is no such thing as a purely digital design at advanced nodes today. Even designs that have no [getkc id="37" kc_name="analog"] content are likely relying on [getkc id="38" kc_name="mixed-signal"] components such as SerDes for communications, or voltage regulators for adaptive power control. But the days of purposely attempting to integrate everything including analog and RF onto a single... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

Managing Peak Power


Peak power is becoming a serious design constraint across chips and entire electronic systems as more functionality is added into end devices and the compute and switching infrastructure needed to support them. The issues are a direct result of growing complexity in designs, fixed or shrinking power budgets, and the need to process more data more quickly. In mobile devices, the addition of m... » read more

What’s After 7nm?


The rollout of 10/7nm was a long time coming, and for good reason. It's hard stuff, and chipmakers have to be ready to take a giant step forward with new processes, tools, and to deal with a slew of physical effects that no longer can be handled by just guard-banding a design. The big question is what's next, when it will happen, and how much it will cost. Preparing for the next process node... » read more

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