tag: 3D

Chipmaking In The Third Dimension
By Krishnan Shrinivasan - 16 Jun, 2022 - Comments: 0

Every few months, new and improved electronics are introduced. They’re typically smaller, smarter, faster, have more bandwidth, are more power-efficient, etc. — all thanks to a new generation of advanced chips and processors. Our digital society has come to expect this steady drip of new devices as sure as the sun will rise tomorrow. Behind the scenes, however, engineers are working feve... » read more

Inverse Design of Inflatable Soft Membranes Through Machine Learning
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "Across fields of science, researchers have increasingly focused on designing soft devices that can shape-morph to achieve functionality. However, identifying a rest shape that leads to a target 3D shape upon actuation is a non-trivial task that involves inverse design capabilities. In this study, a simple and efficient platform is presented to design pre-programmed 3D shapes starting... » read more

Future Challenges For Advanced Packaging
By Mark LaPedus - 20 Jan, 2022 - Comments: 1

Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the technology. What follows are excerpts of that discussion. SE: We’re in the midst of a huge semiconductor demand cycle. What’s driving that? Kelly: If you take a step back, our industry has always ... » read more

Industrial Radiography — CT Scanning for Metrology Applications
By CyberOptics - 09 Nov, 2021 - Comments: 0

Xray technology, more specifically computed tomography (CT), has been adapted for use as an instrument of industrial metrology. Early adopters have quickly recognized the benefits of internal and external nondestructive testing for 3D defect detection and geometric analysis, while those considering adoption may be uncertain how to implement the technology effectively. This study was conducted t... » read more

Automated ESD Protection Verification For 2.5D And 3D ICs
By Siemens EDA - 22 Sep, 2021 - Comments: 0

While automated flows for ESD protection verification are well-established for 2D ICs, 2.5D and 3D designs present new challenges in both ESD circuit design and verification. Advanced automated ESD verification methodology accurately and effectively evaluates ESD protection in 2.5/3D IC designs. Ensuring correct and consistent ESD protection in 2.5/3D ICs raises the reliability and product life... » read more

Why Wafer Bumps Are Suddenly So Important
By Anne Meixner - 10 Aug, 2021 - Comments: 2

Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing measurement technologies. Bump co-planarity is essentially a measure of flatness. Specifically, it measures the variation in bump height, which may have a target, for example, of about 100 microns. As a ... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

3D Stacking For Performance And Efficiency
By Brian Cline - 08 Apr, 2021 - Comments: 0

Moore’s Law scaling is slowing down and limited improvements in performance, power, area, and cost are available from one process node to the next. As a result, advanced packaging and 3D stacking technologies are taking a front seat as the key drivers for next-generation high-performance energy-efficient designs. These types of system-in-package (SiP) technologies require designers to reima... » read more

Brazil Paves New Semiconductor Path
By Mark LaPedus - 22 Feb, 2021 - Comments: 3

After struggling to get its semiconductor industry off the ground for the last several years, Brazil finally may have found its place in the market with the development of IC design services, memory modules and packaging. Brazil exists well under the radar when it comes to semiconductors. But with little or no fanfare, the nation over the years has been trying to build fabs, assemble chips a... » read more

Momentum Builds For Advanced Packaging
By Mark LaPedus - 17 Sep, 2020 - Comments: 0

The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs. Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce p... » read more

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