Considerations for programmable devices in automotive and industrial applications.
Advances in design and manufacturing technology allow increased factory automation, where tasks are automatically performed by sophisticated equipment such as industrial robots. Manufacturing processes require fail-safe mechanisms to prevent human injury or costly downtime. With increasing sophistication and automation of the manufacturing processes, there is increasing need for error detection and recovery methods. The design of industrial and automotive applications requires the integration of functional safety measures to ensure the system or equipment operates correctly. This includes safe handling of operator errors, hardware failures or environmental changes. These overall functional safety requirements are defined by the ISO 26262 standard for automotive and the IEC 61508 standard for industrial applications. Due to the re-programmability, long lifespans and high processing bandwidth, FPGAs are being used for industrial and automotive designs. This is requiring FPGA designers to provide for the addition of functional safety features within their designs.
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Chips will cost more to design and manufacture even without pushing to the latest node, but that’s not the whole story.
Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.
Technology adds more granularity, but starting point for design shifts as architectures cope with greater volumes of data.
GlobalFoundries’ decision to put 7nm on hold is raising concerns across the mil/aero industry.
Different perspectives and needs create friction as more advanced electronics are added into vehicles.
Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful.
Using the Von Neumann architecture for artificial intelligence applications is inefficient. What will replace it?
Slowdown due to impact on timing, and dependencies between power, thermal and timing that may not be caught by signoff tools.
Assessing the reliability of a device requires adding more physical factors into the analysis, many of which are interconnected in complex ways.
Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.
Old solutions don’t necessarily work anymore, particularly at advanced nodes and ultra-low voltage.
The number of critical design metrics is expanding, but the industry still grapples with their implications.
Understanding aging factors within a design can help reduce the likelihood of product failures.
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