Where Advanced Packaging Makes Sense


Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Blog Review: Dec. 5


Mentor's Harry Foster digs into verification effectiveness in FPGA projects and what it means that so many non-trivial bugs escape into production. Cadence's Paul McLellan checks out an effort to integrate photonics with CMOS and find the tradeoffs in three different approaches, plus the view of photonics as applied to military aircraft. Synopsys' Richard Solomon shares some highlights on... » read more

Looking Beyond The CPU


CPUs no longer deliver the same kind of of performance improvements as in the past, raising questions across the industry about what comes next. The growth in processing power delivered by a single CPU core began stalling out at the beginning of the decade, when power-related issues such as heat and noise forced processor companies to add more cores rather than pushing up the clock frequency... » read more

Getting Down To Business On Chiplets


Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Blog Review: Nov. 21


Cadence's Paul McLellan looks at why specialized architectures will be the future of processor development, why general purpose processors are a poor match for AI, and other highlights from the recent Linley Processor Conference. Mentor's Harry Foster focuses on what's happening in FPGA design and the factors that are adding to increasing design and verification complexity. Synopsys' Lewi... » read more

AI Begins To Reshape Chip Design


Artificial intelligence is beginning to impact semiconductor design as architects begin leveraging its capabilities to improve performance and reduce power, setting the stage for a number of foundational shifts in how chips are developed, manufactured and updated in the future. AI—and machine learning and deep learning subsets—can be used to greatly improve the functional control and pow... » read more

Chips In Space


Geoff Tate, CEO of Flex Logix, talks about why embedded FPGAs are being tapped for accelerators in satellites and airplanes, why programmability is so critical to deal with changes in technology that can span decades from initial design. https://youtu.be/ynZYKXcLCzE » read more

The Impact of Domain Crossing on Safety


Semiconductor Engineering sat down to discuss problems associated with domain crossings with Alex Gnusin, design verification technologist for Aldec; Pete Hardee, director, product management for Cadence; Joe Hupcey, product manager and verification product technologist for Mentor, a Siemens Business; Sven Beyer, product manager design verification for OneSpin; and Godwin Maben, applications en... » read more

What Will Intel Do Next?


The writing is on the wall for big processor makers. Apple, Amazon, Facebook and Google are developing their own processors. In addition, there are more than 30 startups developing various types of AI accelerators, as well as a field of embedded FPGA vendors, a couple of discrete FPGA makers, and a slew of soft processor cores. This certainly hasn't been lost on Intel. As the world's largest... » read more

Intel’s Next Move


Gadi Singer, vice president and general manager of Intel's Artificial Intelligence Products Group, sat down with Semiconductor Engineering to talk about Intel's vision for deep learning and why the company is looking well beyond the x86 architecture and one-chip solutions. SE: What's changing on the processor side? Singer: The biggest change is the addition of deep learning and neural ne... » read more

← Older posts