Multiphysics co-simulation links chip, package, and system levels for simultaneous analysis of many interdependent factors in context of their mutual interactions in the full 3D-IC system.
As connectivity, digitalization, and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System-on-a-Chip.
Winning demands a new design paradigm that enables cross disciplinary multiphysics interaction, delivering innovation at the speed of light and unleashing disruptive competitive advantage – all with substantially reduced cost.
This e-book introduces the five critical capabilities required to deliver the new design paradigm supported by real-world examples.
Click here to read more.
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