Chip Industry Week In Review

By The SE Staff - 19 Jul, 2024 - Comments: 0

The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

Data Center Thermal Management Improves

By Karen Heyman - 18 Jul, 2024 - Comments: 0

Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate. “Everybody wants to try to do more in a small volume of space,” said St... » read more

Digital Twins Gaining Traction In Complex Designs

By Ann Mutschler - 27 Jun, 2024 - Comments: 0

The integration of heterogeneous chiplets into an advanced package, coupled with the increasing digitalization of multiple industry segments, is pushing digital twins to the forefront of design. The challenge in these complex assemblies is figuring out the potential tradeoffs between different chiplets, different assembly approaches, and to be able to do it quickly enough to still hit market... » read more

EDA Looks Beyond Chips

By Ed Sperling - 25 Apr, 2024 - Comments: 0

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

The 3D-IC Multiphysics Challenge Dictates A Shift-Left Strategy

By John Ferguson - 25 Apr, 2024 - Comments: 0

As the industry marches forward in a 3D-IC centric design approach (figure 1), we are facing a new problem. Sometimes referred to as “electro-thermal” or “electro-thermo-mechanical,” it really is the confluence of multiple forms of physics exerting impacts on both the physical manufacture and structure of these multi-die designs and their electrical behavior. Fig. 1: Illustration... » read more

3D-IC Design: An Innovative Approach To Chip Integration

By Akanksha Soni - 11 May, 2023 - Comments: 0

Advancements in technology have led to the development of increasingly complex and densely integrated circuits (ICs). To keep up with the ever-growing demand for high-performance and power-efficient devices, the industry has shifted toward 3D-IC design. 3D-ICs have many applications in a wide range of industries, including consumer electronics, telecommunications, computing, and automotive. Wh... » read more

Multiphysics Analysis of Traction Motors: Accelerating Innovation in Electric Mobility Solutions

By Ansys - 11 Jan, 2023 - Comments: 0

Between 2021 and 2023, electric vehicles (EVs) represent a $7 trillion market opportunity, and it’s only projected to increase. In a rapidly growing EV market, automakers are turning to advanced design, testing, and manufacturing technologies. Optimized system design requires the evaluation of many different concepts, topologies, and electronic interactions across disciplines. Design and s... » read more

Coming In Hot: Requirements For Successful Thermal Management In 3D-IC

By Marc Swinnen - 03 Oct, 2022 - Comments: 0

As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often the number one limiting factor in 3D-IC design. High-speed chips stacked close together in a small housing cause things to heat up fast. One of the most common designer responses to overheating ... » read more

Multiphysics Signoff Solvers At DAC 2022

By Marion Blanc - 09 Jun, 2022 - Comments: 0

It seems like just yesterday when engineers were trying to fit all the functionality they could onto a monolithic 2D integrated circuit to maximize computing performance. Moore’s Law was going strong and standard chips were what everybody used. The Design Automation Conference (DAC) 2022, scheduled for July 10 to 14 in San Francisco, will show just how far we’ve come from those days. We�... » read more

State-Space Model Of An Electro-Mechanical-Acoustic Contactless Energy Transfer System Based On Multiphysics Networks

By Fraunhofer IIS/EAS - 11 May, 2022 - Comments: 0

Contactless energy transfer systems are mainly divided into acoustic, inductive, capacitive and optical, in which main applications are related to biomedical, wireless chargers and sensors in metal enclosures. When solids are used as transfer media, ultrasound transducers based on piezoelectricity can be used for through-wall power transfer, which can be named as electro-mechanical-acoustic con... » read more

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tag: multiphysics