tag: multiphysics

3D-IC Design: An Innovative Approach To Chip Integration
By Akanksha Soni - 11 May, 2023 - Comments: 0

Advancements in technology have led to the development of increasingly complex and densely integrated circuits (ICs). To keep up with the ever-growing demand for high-performance and power-efficient devices, the industry has shifted toward 3D-IC design. 3D-ICs have many applications in a wide range of industries, including consumer electronics, telecommunications, computing, and automotive. Wh... » read more

Multiphysics Analysis of Traction Motors: Accelerating Innovation in Electric Mobility Solutions
By Ansys - 11 Jan, 2023 - Comments: 0

Between 2021 and 2023, electric vehicles (EVs) represent a $7 trillion market opportunity, and it’s only projected to increase. In a rapidly growing EV market, automakers are turning to advanced design, testing, and manufacturing technologies. Optimized system design requires the evaluation of many different concepts, topologies, and electronic interactions across disciplines. Design and s... » read more

Coming In Hot: Requirements For Successful Thermal Management In 3D-IC
By Marc Swinnen - 03 Oct, 2022 - Comments: 0

As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often the number one limiting factor in 3D-IC design. High-speed chips stacked close together in a small housing cause things to heat up fast. One of the most common designer responses to overheating ... » read more

Multiphysics Signoff Solvers At DAC 2022
By Marion Blanc - 09 Jun, 2022 - Comments: 0

It seems like just yesterday when engineers were trying to fit all the functionality they could onto a monolithic 2D integrated circuit to maximize computing performance. Moore’s Law was going strong and standard chips were what everybody used. The Design Automation Conference (DAC) 2022, scheduled for July 10 to 14 in San Francisco, will show just how far we’ve come from those days. We�... » read more

State-Space Model Of An Electro-Mechanical-Acoustic Contactless Energy Transfer System Based On Multiphysics Networks
By Fraunhofer EAS - 11 May, 2022 - Comments: 0

Contactless energy transfer systems are mainly divided into acoustic, inductive, capacitive and optical, in which main applications are related to biomedical, wireless chargers and sensors in metal enclosures. When solids are used as transfer media, ultrasound transducers based on piezoelectricity can be used for through-wall power transfer, which can be named as electro-mechanical-acoustic con... » read more

3D-IC: Great Opportunities, Great Challenges
By John Lee - 17 Feb, 2022 - Comments: 0

The growing adoption of 2.5D and 3D integrated circuits (3D-ICs) marks a major inflection point in the world of semiconductor design. Electronic designers demand greater integration densities and faster data transfer rates to meet the growing performance requirements of AI/ML, 5G/6G networks and autonomous vehicles as these technologies have outpaced the capabilities of any single chip. 3D-IC t... » read more

Behold The Dawning Of The Era Of Bespoke Silicon
By John Lee - 10 Feb, 2022 - Comments: 0

The great chip shortage of 2021, which accounted for billions of dollars in revenue loss, hit the auto industry especially hard. What caused the shortage is clear: auto companies miscalculated the impact of the COVID-19 pandemic. While automakers were canceling their chip orders, strong electronics sales continued, leaving automakers at the back of the line for chips when demand for cars reboun... » read more

SuperGrid Institute Responds to Energy and Climate Demands
By Ronak Shah - 13 Jan, 2022 - Comments: 0

Researchers and developers at SuperGrid Institute use Ansys electronics software solutions to perform studies on power converters, critical links in the chain between electric generators and consumers, for their clients. Fig. 1: Medium-voltage DC grid power supply topology. As an independent research and innovation institute based in France, SuperGrid Institute is dedicated to developin... » read more

High-Tech: Innovation At The Speed of Light
By Ansys - 12 Jan, 2022 - Comments: 0

As connectivity, digitalization, and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System-on-a-Chip. Winning demands a new design paradigm that ... » read more

Building Complex Chips That Last Longer
By Ed Sperling - 23 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

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