tag: multiphysics

Thermal Management In 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies
By Reela Samuel - 11 Dec, 2025 - Comments: 1

As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted from a downstream constraint to a fundamental design driver. The dense vertical integration that enables unprecedented performance also concentrates heat at levels that traditional two-dimensional design ... » read more

Optimizing Optical Fiber Connections In Hyperscale Datacenters: A Simulation-Driven Approach
By Ansys - 15 Oct, 2025 - Comments: 0

Hyperscale datacenters are redefining the limits of data transmission technology, driven by increasing demands for higher bandwidth, lower power consumption, and reduced latency. Through advanced simulation workflows and multiphysics integration, engineers can design, optimize, and validate optical coupling systems for next-generation datacenters. The use of Ansys Optics software for photonic c... » read more

Preparing For The Multiphysics Future Of 3D-ICs
By Siemens EDA - 29 Sep, 2025 - Comments: 0

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure success... » read more

How Multiphysics Is Powering The Future Of 3D-ICs
By John Ferguson - 29 Sep, 2025 - Comments: 0

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already thinking vertically. By 1983, Fujitsu manufactured the first 3D IC prototype using through-silicon via (TSV) technology, using laser beam recrystallization. That’s a long time for a good idea to catc... » read more

Digital Engineering Transforms Chips For The Future
By Jayraj Nair - 14 Aug, 2025 - Comments: 0

The semiconductor industry stands at a critical turning point. With global semiconductor sales exceeding $600 billion last year, the need for the industry to scale has never been more apparent. As AI applications drive unprecedented requirements for processing capabilities, chip designers are turning to advanced simulation technologies to enable the digital engineering workflows that will sup... » read more

A Better Path To Better 3D-IC Thermal Modeling
By Andras Vass-Varnai - 17 Jul, 2025 - Comments: 0

By Andras Vass-Varnai, Lee Wang, John Parry, Byron Blackmore, and Sudarshan Deo In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits has become a make-or-break factor in product success. The traditional approach of treating thermal analysis as an ... » read more

EBook: Optimizing Analog Design With Multiphysics
By Ansys - 16 Jul, 2025 - Comments: 0

As technologies like artificial intelligence (AI), 5G, electric vehicles, and high-speed computing continue to advance, analog and mixed-signal (AMS) technologies have become the unsung heroes of next-gen electronics. AMS chips are enabling smarter, faster, and more efficient systems, but traditional design approaches are struggling to keep pace. Interconnect parasitics, power integrity, photo... » read more

How to Accelerate Multiphysics Simulation Software with Turnkey Hardware Systems
By Ansys - 13 Nov, 2024 - Comments: 0

Complicated problems take longer to solve. In engineering, it’s a given that simulation drastically accelerates the development cycle, enabling engineers to digitally test ideas and optimize products exponentially faster than physical testing. However, today’s complex products and systems require simulation of many different physics—the thermal, structural, and electromagnetic forces in a... » read more

Reliability On The Road: Multiphysics Design For Automotive 3D-ICs
By John Ferguson - 07 Nov, 2024 - Comments: 0

Anyone who has purchased a car over the past decade knows that there has been a huge increase in the amount of compute processing involved in today’s modern automotive industry. Advanced chips for diagnostics and entertainment as well as logic associated with advanced sensor technology and automated assist features have quickly become key requirements that drivers rely on every day to ensure ... » read more

Chip Industry Week In Review
By The SE Staff - 19 Jul, 2024 - Comments: 0

The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

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