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High-Temperature-Stable, Spin-On Carbon Materials For High-Aspect-Ratio Gap-Fill Applications

Novel, high-temperature-stable spin-on carbon (SOC)-based materials with excellent processability.

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Brewer Science, Inc. has developed a class of novel, high-temperature-stable spin-on carbon (SOC)-based materials with excellent processability. These SOCs are cured under mild conditions and have flow properties that enable the fill of high-aspect-ratio vias in a void-free manner. Moreover, this new class of SOCs has remarkable thermal stability and can survive temperatures of up to 550°C with only minimal shrinkage/mass loss. The properties of these SOCs make them ideal candidates for use in high-temperature processes such as CVD and metal deposition.

By Carissa Jones, Runhui Huang, Joyce Lowes, Sean Simmons, and Xing-Fu Zhong of Brewer Science, Inc., Rolla, MO, USA

Published in: 2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Date of Conference: 10-12 May 2021

Click here to find the article in IEEE Explore.



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