The flexibility and configurability of adaptive devices combined improves security processing performance.
Traditional methods of deploying network security through software-based firewalls do not scale because the latency and bandwidth requirements cannot be addressed. The flexibility and configurability of Xilinx adaptive devices combined with IP and tool offerings significantly improves security processing performance.
This white paper explores multiple firewall architectures, which include software- and NPU-based architectures and explains why next-generation designs need an inline firewall architecture using Xilinx’s adaptive devices. Xilinx’s 16nm FPGAs and SoCs and 7nm Versal™ ACAPs offer multiple architectural components in the form of hardened blocks and soft IP, which make them ideal for designing next-generation security appliances. These IPs include high-speed SerDes and multirate interface IP, such as hardened MAC, PCIe® interfaces, and memory controllers. Xilinx devices also offer the latest state-of-the-art memory architecture with soft search IPs for flow classification, making them best suited for network security and firewall applications.
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Disaggregation and the wind-down of Moore’s Law have changed everything.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Continued expansion in new and existing markets points to massive and sustained growth.
Aging equipment and rising demand are pushing up prices and slowing production.
Experts at the Table: Designing for context, and geopolitical impacts on a global supply chain.
Interest in this particular ISA is expanding, but the growth of other open-source hardware is less certain.
Nanosheets are likeliest option throughout this decade, with CFETs and other exotic structures possible after that.
Hybrid bonding opens up whole new level of performance in packaging, but it’s not the only improvement.
Why this is becoming a bigger issue, and what can be done to mitigate the effects.
Some 300mm tools are converted to 200mm; equipment prices and chip manufacturing costs are rising.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Disaggregation and the wind-down of Moore’s Law have changed everything.
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