Adding the power of a digital signal processing engine to DesignWare ARC configurable processor cores to enable RISC and signal processing computation within a single unified architecture.
Instruction-level Parallelism (ILP) refers to design techniques that enable more than one RISC instruction to be executed simultaneously in the same instruction, which boosts processor performance by increasing the amount of work done in a given time interval, thereby increasing the throughput. This parallelism can be explicit, where each additional instruction is explicitly part of the instruction mnemonic, or it can be implicit, where the number and type of operations are encoded into the instruction. Implicit instruction parallelism using XY memory retains the RISC programming model and brings all the XY memories into the pipeline as if they were register files, resulting in a resource-efficient and a much higher performing implementation. The DesignWare ARC XY Advanced DSP extension adds the power of a digital signal processing engine to DesignWare ARC configurable processor cores, enabling RISC and signal processing computation within a single unified architecture.
Click here to read more.
Disaggregation and the wind-down of Moore’s Law have changed everything.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Continued expansion in new and existing markets points to massive and sustained growth.
Aging equipment and rising demand are pushing up prices and slowing production.
Experts at the Table: Designing for context, and geopolitical impacts on a global supply chain.
Interest in this particular ISA is expanding, but the growth of other open-source hardware is less certain.
Nanosheets are likeliest option throughout this decade, with CFETs and other exotic structures possible after that.
Hybrid bonding opens up whole new level of performance in packaging, but it’s not the only improvement.
Why this is becoming a bigger issue, and what can be done to mitigate the effects.
Some 300mm tools are converted to 200mm; equipment prices and chip manufacturing costs are rising.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Disaggregation and the wind-down of Moore’s Law have changed everything.
Leave a Reply