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Large-Field, Fine-Resolution Lithography Enables Next-Generation Panel-Level Packaging

This new capability has the potential to pave the way for the next generation of heterogeneous integration packages.

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The lithography challenge for large heterogeneous integration is the limited size of the exposure field (typically 60mm x 60mm or less) for most currently available lithography systems. Fine resolution and a large field size provide the user with the opportunity to increase the package size beyond 150mm x 150mm and maintain high throughput. This new capability has the potential to pave the way for the next generation of heterogeneous integration packages.

Click here to read more. The white paper was originally published in Chip Scale Review but is available on Onto’s website.

 



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