AI/ML, RISC-V, chiplets, and engineering talent top the list of topics at the 60th DAC.
Spotting key trends over three days of a semiconductor design conference is a challenge, but some important ones come into focus after attending multiple sessions — AI/ML, chiplet integration, and heterogeneous integration in an SoC and package. Frank Schirrmeister, vice president solutions and business development at Arteris IP, talks about a variety of topics that fit under the DAC umbrella, including everything from memory tagging to RISC-V and optimism about new talent.
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