The Week In Review: Design


Tools & IP Synopsys added machine learning capabilities to its Design Platform. The company highlighted benefits to the PrimeTime signoff tool, which saw 5X faster power recovery in customer designs at leading-edge geometries. Renesas is using the tool, noting a 4X power ECO speed-up. ArterisIP unveiled a standalone last level cache (LLC) for high-performance SoCs. CodaCache can be adde... » read more

Power Optimization Strategies Widen


An increasing amount of electronic content in new and existing markets is creating different and sometimes competing demands for power optimization. For the past decade, EDA has been driven by the mobile phone industry, where the emphasis is on better power analysis and optimization tools to reduce power consumption and extend battery life. While energy efficiency continues to improve, other... » read more

The Week In Review: Design


M&A ANSYS finalized its acquisition of OPTIS. Founded in 1989, OPTIS provided software for scientific simulation of light, human vision and physics-based visualization. The acquisition boosts the company's automotive simulation portfolio with radar, lidar and camera simulation. Terms were not disclosed. IP Arm debuted the Cortex-M35P processor. Aimed at IoT applications, the IP combine... » read more

Neural Nets In ADAS And Autonomous Driving SoC Designs


Automotive electronics has ushered in a new wave of semiconductor design innovation and one new technology gaining a lot of attention is neural networks (NNs). Advanced driving assistance systems (ADAS) and autonomous car designs now rely on NNs to meet the real-time requirements of complex object-recognition algorithms. The concept of NNs has been around since World War II, promising a futu... » read more

Deep Learning And The Future


Following up from my last post on our deep learning event at the Computer History Museum – “ASICs Unlock Deep Learning Innovation,” I’d like to take a glimpse into the future. Like many such discussions, it’s often useful to take a look back first to try and make sense out of what is to come.  That’s essentlially what our keynote speaker, Ty Garibay, did at the event. Ty is the CTO... » read more

The Week In Review: Design


Market research firm IC Insights says fabless IC suppliers accounted for 27% of the world’s IC sales in 2017—an increase from 18% ten years earlier in 2007. U.S. companies accounted for the greatest share of fabless IC sales last year at 53% (down, however, from 2010's share of 69%). Since 2010, the largest fabless IC marketshare increase has come from the Chinese suppliers, which captured ... » read more

The Week In Review: Design


Tools Synopsys debuted new versions of its circuit simulation and custom design products. FineSim SPICE provides 2X faster simulation and Monte Carlo analysis speed, CustomSim FastSPICE offers 2X speed-up for post-layout SRAM simulation and maintains multi-core scalability by providing additional 2X speed-up on four cores, and HSPICE delivers 1.5X speed-up for large post-layout designs, accord... » read more

The Week In Review: Design


M&A Microchip inked an agreement to acquire Microsemi, provider of chips for defense and aerospace, for $68.78 per share in cash. The acquisition price represents a total equity value of about $8.35 billion and a total enterprise value of about $10.15 billion, according to Microchip. The deal is expected to close in the second quarter of 2018. Silvaco acquired NanGate. Founded in 2004, ... » read more

The Week In Review: Design


Startup OnScale launched with advanced CAE multi-physics solvers that are seamlessly integrated with a scalable, high performance cloud computing platform built on Amazon's AWS. The company's model is built around a Solver-as-a-Service pay-as-you-go subscription model and targets 5G, IoT/Industrial IoT, biomedical, and autonomous car markets. The company has $3 million in strategic seed fund... » read more

The Week In Review: Design


Tools & IP Pro Design launched three new proFPGA Zynq UltraScale+ FPGA modules for SoC and IP prototyping. The modules combine FPGA logic with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors and on-board interfaces. The modules offer a total of up to 5 extension sites with 531 standard I/Os and 16 multi-gigabit transceivers (MGTs). The board allows a maximum point-to-point ... » read more

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