mmWave Chip, Package, And Board Beamforming Solutions

5G RF front-end architectures require innovations in system-in-package (SiP) design.


RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with electronic systems implemented through innovations in system-in-package (SiP) design.

5G data rates exceeding 1GB/s will be supported by the available bandwidth in the millimeter-wave (mmWave) spectrum and use of beam steering phased array antennas and multiple communication chains, which can range from eight to 64 elements in a typical system. A reference design (shown in Figure 1) has been developed to demonstrate how Cadence software tools, inclusive of the AWR Design Environment platform, support the development of such a system, from the 5G antenna array on a PCB through the package-on-package design and complementary metal-oxide semiconductor (CMOS) receiver IC.

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