Using power-aware SI analysis and thermal-aware PI analysis as part of a system design and signoff methodology for GDDR6 designs.
Graphics processing units (GPUs) and graphics double data rate (GDDR) memory interfaces are essential to graphics cards, game consoles, high-performance computing (HPC), and machine learning applications. These interfaces enable data transfer speeds of over 665GB per second today and will continue to support well over a terabyte per second (TBps) in next-generation GDDR interfaces. Signal integrity (SI) and power integrity (PI) are becoming intertwined with the thermal issues caused by ultra-fast data transfer rates, ultra-low voltage swings, and high-density GDDR6 designs often implemented on silicon interposers. This paper describes using power-aware SI analysis and thermal-aware PI analysis as part of a system design and signoff methodology for GDDR6 designs.
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