PADKs can increase productivity, reduce cycle times, and limit the number of design iterations in HDFO applications.
A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor.
Find the technical paper here. September 2024.
“Although package design and IC design are two different worlds, they share several key similarities that have contributed to the successful use of Package Assembly Design Kits (PADKs). By using PADKs, designers can significantly increase productivity, reduce cycle times, and limit the number of design iterations in HDFO (High-Density Fan-Out) applications,” states the paper.
R. Fuentes and J. Micksch, “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing,” 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 2024, pp. 1-4, doi: 10.1109/ESTC60143.2024.10712031.
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