tag: Intel

Foundries See Mixed Future
By Mark LaPedus - 21 Dec, 2016 - Comments: 1

Amid a tumultuous business environment, the silicon foundry industry is projected to see steady growth in a number of process segments in 2017. As in past years, the foundry market is expected to grow faster than the overall IC industry in 2017. But at the same time, the IC industry—the foundry customer base—continues to witness a frenetic wave of merger and acquisition activity. Basical... » read more

Green Computing: GPUs Strike Back
By Barry Pangrle - 19 Dec, 2016 - Comments: 1

After the last Platform for Advanced Scientific Computing Conference in June, I wrote an article here about how the custom designed chips from NRCPC (used in the Sunway TaihuLight) and PEZY Computing (used in the PEZY Shoubu) had jumped to the top of the Green500 list with the Sunway TaihuLight also remarkably topping the Top500 list. Well, six months after the report from the IEEE/ACM SC16 Con... » read more

Uncertainty Grows For 5nm, 3nm
By Mark LaPedus - 19 Dec, 2016 - Comments: 4

As several chipmakers ramp up their 10nm finFET processes, with 7nm just around the corner, R&D has begun for 5nm and beyond. In fact, some are already moving full speed ahead in the arena. [getentity id="22586" comment="TSMC"] recently announced plans to build a new fab in Taiwan at a cost of $15.7 billion. The proposed fab is targeted to manufacture TSMC’s 5nm and 3nm processes, whic... » read more

The Week In Review: IoT
By Jeff Dorsch - 16 Dec, 2016 - Comments: 0

Tools Google this week updated its Internet of Things platform, releasing a Developer Preview for Android Things, enabling application developers to create IoT devices running on the mobile Android operating system. “We incorporated the feedback from Project Brillo to include familiar tools such as Android Studio, the Android Software Development Kit (SDK), Google Play Services, and Google C... » read more

Morphing Moore’s Law
By Ed Sperling - 15 Dec, 2016 - Comments: 0

In 1965, Gordon Moore defined a timetable for doubling the number of transistors on a piece of silicon every two years. The law, as he originally defined it, is now hopelessly outdated. Any attempts to apply it to the most advanced chips today are a stretch at best, and complete fiction at worst. No one is on a two-year cadence between process nodes anymore—not even Intel. In fact, no one ... » read more

5 Takeaways from IEDM
By Mark LaPedus - 15 Dec, 2016 - Comments: 1

As usual, the recent IEEE International Electron Devices Meeting (IEDM) was a busy week. The event, which took place in San Francisco, featured a plethora of subjects, such as next-generation transistors and memories. The event also included tracks on non-traditional approaches like quantum and neuromorphic computing. And then, there were sessions on power semis and others. In no partic... » read more

BEOL Issues At 10nm And 7nm (Part 1)
By Ed Sperling - 15 Dec, 2016 - Comments: 5

Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

Fab Tool Biz Faces Challenges In 2017
By Mark LaPedus - 15 Dec, 2016 - Comments: 3

After experiencing a gradual recovery and positive growth in 2016, the semiconductor equipment industry sees a mixed picture as well as some uncertainty in 2017. In the near term, though, business is robust. Several chipmakers started to place a sizeable number of fab tool orders in the latter part of 2016, particularly in three areas—3D NAND, logic and foundry. Now, after buying the in... » read more

Blog Review: Dec. 14
By Jesse Allen - 14 Dec, 2016 - Comments: 0

What are the technology options for 5nm? Cadence's Paul McLellan highlights an IEDM presentation by An Steegen of Imec. Synopsys' Michael Posner suggests we may not have to live with USB Type-C dongles for very long. Mentor's Craig Armenti presents some of the fundamental best practices and guidelines for rigid-flex PCB design. NXP's Joe Byrne digs into the Mirai botnet attack, arguing... » read more

The Week In Review: IoT
By Jeff Dorsch - 09 Dec, 2016 - Comments: 0

Analysis Some consumer IoT products are actually useful and helpful in daily life, such as the Nest Learning Thermostat and the Honeywell Lyric for home automation, David Pogue writes. Then there are the products that make most people scratch their heads – IoT water bottles, the IoT toilet-paper dispenser, the IoT toothbrush, IoT umbrella, IoT fork, the IoT egg tray, and so on, he notes. “... » read more

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