tag: ANSYS

Blog Review: May 28
By Ed Sperling - 28 May, 2014 - Comments: 0

Ansys’ Robert Harwood examines the crossover between drones and 3D printing—particularly ones that can make repairs in inaccessible or hazardous areas. That could make both of them more popular. Mentor’s Mathew Clark puts a new spin on the term “gumming up the works.” Poor little things. Cadence’s Brian Fuller drills into Google’s Project Ara, the magnetic LEGO architecture ... » read more

Blog Review: May 21
By Ed Sperling - 21 May, 2014 - Comments: 0

Mentor’s Colin Walls offers up some new insights into C++ exception handling, thanks to some input from colleague Jonathan Roelofs. This one involves minimizing overhead and reducing runtime penalties. Synopsys’ Mick Posner is back in the saddle again—literally. This is about as green as it gets. Cadence’s Arthur Marris reports back on the IEEE 802.3 Ethernet standards meeting, in... » read more

Blog Review: May 7
By Ed Sperling - 07 May, 2014 - Comments: 0

What if your toothbrush could talk? Semico Research’s Michell Prunty looks at the crowd-funded connected toothbrush design. And what else can it do? Cadence’s Richard Goering attended the Electronic Design Process Symposium in Monterey and summed up the progress in ESL: Power is less of an issue (for the moment), emulation is cheaper, but there is still a dearth of expertise and standard... » read more

Blog Review: April 23
By Ed Sperling - 23 Apr, 2014 - Comments: 0

Mentor’s John Day looks backward through a smart rearview mirror from Nissan. No glare, even at night or at sunset, and a wider field of vision. You have to wonder why this technology took so long. Synopsys’ Karen Bartleson wonders when the IoT will actually arrive, given the delay in durable goods, a concern over security and the effects of government regulation. Answer: When we stop ta... » read more

Blog Review: April 9
By Ed Sperling - 09 Apr, 2014 - Comments: 0

Mentor’s Colin Walls discovered an interesting video of the software programming learning process—a teacher responding literally to commands from his students on how to make a jam sandwich. It’s harder than it looks. Cadence’s Brian Fuller captures a speech by his colleague, Sanjiv Taneja, about the need for a comprehensive verification approach and smart IP reuse. The overriding th... » read more

EDA Shapes Its Future
By Brian Bailey - 27 Mar, 2014 - Comments: 2

In part one of this series, Semiconductor Engineering looked at growth within the EDA industry and the types of approaches being made to expand the scope of the markets that they serve. Scope expansion comes from the creation of new tools, the growth of companies in the IP space and the various ways in which opportunities can be found in new markets. Additional growth opportunities come from so... » read more

The Week In Review: System-Level Design
By Ed Sperling - 14 Feb, 2014 - Comments: 0

Cadence bought TranSwitch’s high-speed interface IP assets. TranSwitch, which made chips for communications equipment, filed for bankruptcy in November. (The company’s Web site is no longer active.) Cadence also won a deal with Microsoft, which will use Tensilica processors in the new Xbox One audio subsystem. And Cadence rolled out HiFi Audio Tunneling for Android, which takes advantage of... » read more

Power And Noise Integrity For Analog/Mixed Signal Designs
By Various Writers - 07 Nov, 2013 - Comments: 0

The convergence of advance process technology, increasing levels of integration, and higher operating frequencies pose considerable challenge to IP designers whose circuits are required to function in variety of conditions. Full-custom and mixed signal circuit designers ensure that their circuits will function by simulating for various operating conditions (PVT, input stimuli, etc). One key asp... » read more

Paving The Way To 16/14nm
By Ed Sperling - 07 Nov, 2013 - Comments: 0

The move to the next stop on the Moore’s Law road map isn’t getting any less expensive or easier, but it is becoming more predictable. Tools and programs are being expanded to address physical effects such as electrostatic discharge (ESD), electromigration and thermal effects from increased current density. Any or all of these three checklist items can affect the reliability of a chip. A... » read more

Current Generation Of FPGAs Pose New Power And Reliability Challenges
By Annapoorna Krishnaswamy - 07 Nov, 2013 - Comments: 0

Today’s FPGAs are being used in a wide variety of applications such as consumer electronics, computer and storage, automotive electronics, and mission critical applications. The flexibility to configure the device based on its need, the ability to reprogram its functions, and the hardware parallelism it offers to quickly process very large amounts of data are some of the reasons why off-the-s... » read more

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