tag: Qualcomm

Manufacturing Bits: June 10
By Mark LaPedus - 10 Jun, 2019 - Comments: 1

Predicting warpage in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, there were several papers on ways to predict variation and warpage in IC packages. Advanced packages are prone to unwanted warpage during the process flow. The warpage challenges escalate as the packages become thinner. Warpage in turn can impact yields in IC packages. ... » read more

Accelerating Endpoint Inferencing
By Kevin Fogarty - 06 Jun, 2019 - Comments: 0

Chipmakers are getting ready to debut inference chips for endpoint devices, even though the rest of the machine-learning ecosystem has yet to be established. Whatever infrastructure does exist today is mostly in the cloud, on edge-computing gateways, or in company-specific data centers, which most companies continue to use. For example, Tesla has its own data center. So do most major carmake... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 May, 2019 - Comments: 0

Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 May, 2019 - Comments: 0

Market research In terms of overall IC sales, Intel has replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17, according to IC Insights. “While Samsung held the full-year number one ranking in 2017 and 2018, Intel is forecast to easily recapture the number one ranking for the full-year of 2019, a position it previously held ... » read more

5G Heats Up Base Stations
By Kevin Fogarty - 07 May, 2019 - Comments: 4

Before 5G can be deployed commercially on a large scale, engineers have to solve some stubborn problems—including how to make a hot technology a whole lot cooler. 5G-capable modem chipsets are already on the market from Qualcomm, Samsung, Huawei, MediaTek, Intel and Apple, with some 5G service (LTE-Advanced/LTE-Advanced Pro) available in the U.S. But still mostly missing from the 5G equati... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 26 Apr, 2019 - Comments: 0

Internet of Things Wing received an Air Carrier Certification from the Federal Aviation Administration to begin making commercial deliveries with drones. The Alphabet unit is cleared to deliver packages in southwestern Virginia. Wing has had a pilot program going in the vicinity of Canberra, Australia, and was recently permitted to make commercial deliveries with unmanned aerial vehicles in th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Apr, 2019 - Comments: 0

Chipmakers Here comes the battle between 5nm and 6nm processes at two foundry vendors—Samsung and TSMC. Meanwhile, Intel is behind and scrambling to get 10nm out the door. (Intel's 10nm is equivalent to 7nm from the foundries.) Last week, TSMC announced delivery of a complete version of its 5nm design infrastructure. TSMC’s 5nm technology is based on a finFET. This week, Samsung anno... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 19 Apr, 2019 - Comments: 0

Internet of Things Combining artificial intelligence with unmanned aerial vehicles could provide a quicker and safer alternative to inspecting roadways for cracks, potholes, and other damage, according to a paper posted on arvix.org. “[M]anual visual inspection [is] not only tedious, time-consuming, and costly, but also dangerous for the personnel. Furthermore, the detection results are alwa... » read more

Week In Review: Design, Low Power
By Jesse Allen - 19 Apr, 2019 - Comments: 0

Intel acquired vision and video FPGA IP company Omnitek. Founded in 1998, the Basingstoke, England-based company has produced FPGA IP cores for video processing including conversion and enhancement, creating arbitrary image warps on a real time video stream, connectivity, and deep learning and AI inferencing. Terms of the deal were not disclosed. Qualcomm and Apple have dropped all litigatio... » read more

How Qualcomm Got Faster Signoff DRC Convergence
By Srinivas Velivala - 28 Mar, 2019 - Comments: 0

Qualcomm Incorporated designs and markets wireless telecommunications products and services that are the foundational technologies that others build upon, from mobile processors to embedded platforms, Bluetooth products, and cellular modems. In the fast-moving mobile phone market in which Qualcomm competes, companies who can get to market more quickly gain a strong competitive advantage, along ... » read more

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