Improving the pre-packaged test quality and establishing new tests between the stacked die.
As the industry transitions to 3D ICs, new test strategies are being developed to meet to two 3D IC test goals: improving the pre-packaged test quality and establishing new tests between the stacked die. Solutions for 3D IC test are developing rapidly and are based on mature technologies. In this paper, we describe a test strategy for 3D ICs based on a plug-and-play architecture that allows die, stack, and partial stack level tests to use the same test interface, and to retarget die-level tests directly to the selected die within the 3D stack.
To download this white paper, click here.
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