Plug-And-Play Test Strategy For 3D ICs

Improving the pre-packaged test quality and establishing new tests between the stacked die.

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As the industry transitions to 3D ICs, new test strategies are being developed to meet to two 3D IC test goals: improving the pre-packaged test quality and establishing new tests between the stacked die. Solutions for 3D IC test are developing rapidly and are based on mature technologies. In this paper, we describe a test strategy for 3D ICs based on a plug-and-play architecture that allows die, stack, and partial stack level tests to use the same test interface, and to retarget die-level tests directly to the selected die within the 3D stack.

To download this white paper, click here.