Reliability depends on consistency in contacts and clean signals.
As AI chips get larger, it becomes much harder to test them. Today, there can be as many as 22,000 pins on a 150mm² die, but in the future that number may increase to 80,000 pins. That creates a huge challenge for the fabs and the testers. Jack Lewis, chief technologist at Modus Test, talks about the intricacies of testing these complex devices, from maintaining contact with those pins even on warped substrates, to avoiding cross-talk, and monitoring how the coaxial sockets used to test these devices are functioning.
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