tag: warpage

Why Metal TIM Warpage Simulations Fail—And How To Fix Them
By Dambi Jo - 16 Jul, 2026 - Comments: 0

By Dambi Jo, JiHyun Kim, GaHyeon Kim, TaeKyeong Hwang, WonChul Do, and KyungRok Park In the semiconductor packaging industry, it is common practice to predict warpage and stress levels through simulation prior to actual product fabrication. This approach helps minimize the cost and time associated with prototype production [1]. The need for simulation-driven design and material optimization ... » read more

Can Fine-Pitch Hybrid Bonding Go High Volume?
By Gregory Haley - 16 Jul, 2026 - Comments: 0

Key Takeaways: Fine-pitch hybrid bonding extends a proven production technology into a manufacturing regime with much smaller margins for particles, surface variation, distortion, and placement error. Die-to-wafer integration allows known-good-die selection, but it exchanges wafer-level parallelism for repeated handling, alignment, and bonding operations. Reaching high volume will de... » read more

Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging
By Anne Meixner - 07 Jul, 2026 - Comments: 0

Key Takeaways:  To support AI/HPC devices, high-density fan-out on panels must deliver increased RDL layer count and micropillar height while decreasing the trace and bump/micropillar pitch.   Metrology and inspection steps assist with achieving known-good panel requirements to avoid throwing away expensive chiplets, such as HBM and TPUs.  Optical measurement systems need to acco... » read more

Panel-Level Packaging’s Second Wave Meets Engineering Reality
By Gregory Haley - 16 Apr, 2026 - Comments: 0

Key Takeaways Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down. Glass improves the warpage and dimensional stability problems of organic substrates but introduces a different class of failure modes that require materials solutions, not process adjustments. The central challenges of panel-level processing are m... » read more

Beating The Heat In 3D Packages
By Laura Peters - 25 Mar, 2026 - Comments: 0

Key Takeaways: Thermal management is a central design constraint, requiring early, thorough planning. Accurate thermal simulation requires AI-driven adaptive meshing and real-world validation. Innovative STCO strategies can drastically reduce GPU peak temperature. As HPC and AI accelerators push power densities to 1kW and beyond, the heat generated by rapidly switching tran... » read more

Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages
By Nathan Whitchurch - 19 Mar, 2026 - Comments: 0

The mechanical behavior of electronic packages is an important consideration at each stage of the assembly process. Many packages are assembled in strip format, making strip warpage a critical challenge for manufacturability and yield. Accurate simulations for strip warpage are an effective tool to determine what factors cause large warpages and to explore solutions before assembly. In these si... » read more

Advanced Packaging Limits Come Into Focus
By Gregory Haley - 19 Mar, 2026 - Comments: 0

Key Takeaways: Packaging is now a performance variable. Substrate, bonding, and process sequence determine what can be built at scale. Warpage underlies most advanced packaging failures and gets harder to control as package sizes grow. Every proposed solution, such as glass, panel processing, and backside power, solves one problem while creating another. Moore's Law has shif... » read more

Mitigating Warpage In Multi-Chiplet Systems
By Laura Peters - 22 Sep, 2025 - Comments: 0

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple factors contribute to warpage, including larger chip sizes, severe thinning of the silicon substrate, temporary bonding and debonding processes, and scaling of bump pitch and size. Each of these ca... » read more

Glass Substrates Gain Momentum
By Laura Peters - 18 Sep, 2025 - Comments: 1

As a package substrate, the benefits of glass are substantial. It's extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that's just for starters. Warpage, a growing problem for multichip packages, is greatly reduced. Chips can be hybrid bonded to redistribution layer pads on glass. And relative to organic-core substrates, glass provides very... » read more

Critical Challenges and Opportunities Related to Polymer-Based Materials in Semiconductor Packaging (NIST, NC State, NREL et al)
By Technical Paper Link - 11 Sep, 2025 - Comments: 0

A new technical paper titled "Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science" was published by researchers at the National Institute of Standards and Technology, North Carolina State University, National Renewable Energy Laboratory, ASE, Intel, Innocentrix, and Binghamton University. Abstract "This Perspective builds up... » read more

← Older posts

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy